Inventor · disambiguated record
Adrian Kiermasz
Also filed as: KIERMASZ ADRIAN
16 granted patents·1 pending application·296 citations·filing 1992–2016
93Inventor score
Top patents by PatentIndex Score
17 records- 0190US5858880AMethod of treating a semi-conductor waferTRIKON EQUIPMENT LIMITED·Filed 1995·Granted Jan 12, 1999·138 cites·16 claims
- 0286US7459100B2Methods and apparatus for sequentially alternating among plasma processes in order to optimize a substrateLAM RES CORP·Filed 2004·Granted Dec 2, 2008·40 cites·24 claims
- 0385US9818658B2Semiconductor wafer processing methods and apparatusMETRYX LTD·Filed 2014·Granted Nov 14, 2017·7 cites·20 claims
- 0483US8364302B2Method of controlling semiconductor device fabricationMETRYX LTD·Filed 2009·Granted Jan 29, 2013·7 cites·14 claims
- 0583US8200447B2Measuring apparatusWILBY ROBERT JOHN·Filed 2011·Granted Jun 12, 2012·7 cites·12 claims
- 0681US7892863B2Measuring apparatusMETRYX LTD·Filed 2007·Granted Feb 22, 2011·11 cites·10 claims
- 0778US8200353B2Measuring apparatusWILBY ROBERT JOHN·Filed 2008·Granted Jun 12, 2012·6 cites·21 claims
- 0876US9423447B2Measurement apparatus and methodKIERMASZ ADRIAN·Filed 2012·Granted Aug 23, 2016·4 cites·5 claims
- 0975US6242366B1Methods and apparatus for treating a semiconductor substrateTRIKON EQUIP LTD·Filed 1999·Granted Jun 5, 2001·50 cites·20 claims
- 1072US8594827B2Method of controlling semiconductor device fabricationMETRYX LTD·Filed 2012·Granted Nov 26, 2013·2 cites·6 claims
- 1170US7018273B1Platen with diaphragm and method for optimizing wafer polishingLAM RES CORP·Filed 2003·Granted Mar 28, 2006·13 cites·20 claims
- 1260US9903750B2Method and device for determining information relating to the mass of a semiconductor waferMETRYX LTD·Filed 2014·Granted Feb 27, 2018·1 cites·31 claims
- 1355US6969307B2Polishing pad conditioning and polishing liquid dispersal systemLAM RES CORP·Filed 2004·Granted Nov 29, 2005·6 cites·35 claims
- 1454US9995783B2Measurement apparatus and methodMETRYX LTD·Filed 2016·Granted Jun 12, 2018·0 cites·8 claims
- 1551US7086936B1Linear chemical mechanical planarization (CMP) system and method for planarizing a wafer in a single CMP moduleLAM RES CORP·Filed 2003·Granted Aug 8, 2006·4 cites·5 claims
- 1633US2017115158A1Semiconductor wafer weighing apparatus and methodsMETRYX LTD·Filed 2015·Application pending·0 cites
- 1713US5492737ADeposition apparatus and methodELECTROTECH EQUIPMENTS LTD·Filed 1992·Granted Feb 20, 1996·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →