Inventor · disambiguated record
Hideyuki Tsutsumi
Also filed as: TSUTSUMI HIDEYUKI
7 granted patents·6 pending applications·54 citations·filing 2000–2011
83Inventor score
Top patents by PatentIndex Score
13 records- 0188US6613692B1Substrate processing method and apparatusTOKYO ELECTRON LTD·Filed 2000·Granted Sep 2, 2003·35 cites·13 claims
- 0277US10098269B2Manufacture work machine for controlling a plurality of work-element performing apparatuses by central control deviceKODAMA SEIGO·Filed 2011·Granted Oct 9, 2018·3 cites·10 claims
- 0377US9291302B2Device attachment memberIWAKI NORIAKI·Filed 2011·Granted Mar 22, 2016·4 cites·8 claims
- 0462US7191785B2Substrate processing apparatus for resist film removalTOKYO ELECTRON LTD·Filed 2003·Granted Mar 20, 2007·6 cites·14 claims
- 0561US7737207B2Resin composition and flexible printed circuit boardOTSUKA CHEMICAL CO LTD·Filed 2009·Granted Jun 15, 2010·1 cites·13 claims
- 0657US7361705B2Resin composition and flexible printed circuit boardOTSUKA CHEMICAL CO LTD·Filed 2000·Granted Apr 22, 2008·5 cites·13 claims
- 0757US2007066736A1Resin composition for reflecting platesOTSUKA CHEMICAL CO LTD·Filed 2006·Application pending·0 cites
- 0853US2007204885A1Substrate processing apparatus for resist film removalTOKYO ELECTRON LTD·Filed 2007·Application pending·0 cites
- 0953US2008099725A1Resin composition and flexible printed circuit boardOTSUKA CHEMICAL CO LTD·Filed 2007·Application pending·0 cites
- 1045US2005131121A1Resin composition for reflecting plateFiled 2002·Application pending·0 cites
- 1143US2007136732A1Resource assigning method and diagnostic system of arithmetic circuit using the sameFUJITSU LTD·Filed 2006·Application pending·0 cites
- 1242US2003181560A1Resin composition, molded object thereof, and use thereofFiled 2001·Application pending·0 cites
- 1337US8189594B2Method of controlling header compression in wireless communication, wireless base station, and transmitterNAKATSUJI MITSURU·Filed 2009·Granted May 29, 2012·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →