Resin composition and flexible printed circuit board

Abstract

A resin composition characterized as containing (A) a synthetic resin having a melting temperature of 300° C. or above and (B) a platy inorganic filler incorporated in the resin and having the following properties; pH of aqueous dispersion: 5.5-8.0, amount of extracted alkalis: Na 30 ppm or below and K 40 ppm or below, maximum diameter a: 50 μm or below, thickness b: 1.0 μm or below, and aspect ratio (a/b): 20 or above.

1 - 10 . (canceled)  
     
     
         11 . A thermoplastic resin composition comprising: 
 (A) a thermoplastic resin having a melting temperature of 300° C. or above, and    (B) a platy inorganic filler incorporated in the thermoplastic resin and having the following properties:    pH of aqueous dispersion: which is determined by metering a 1 g sample into a 100 ml beaker, introducing 100 ml of deionized water into the beaker, stirring the beaker content by a magnetic stirrer for 10 minutes, and then measuring its pH by a pH meter: 5.5-8.0;    amount of extracted alkalis: which is determined by dispersing a 1 g sample in 100 ml water and stirring the resulting aqueous dispersion at room temperature for 1 hour and filtering it through a No. 5 filter paper to obtain a filtrate which subsequently is measured by atomic absorption spectrometry: Na 30 ppm or below and K 40 ppm or below;    maximum diameter a: 50 μm or below;    thickness b: 1.0 μm or below; and    aspect ratio (a/b): 20 or above,    wherein said platy inorganic filler is incorporated in said thermoplastic resin, and said resin composition has thermal plasticity.    
     
     
         12 . The thermoplastic resin composition as recited in  claim 11 , wherein said platy inorganic filler is a flaky mica.  
     
     
         13 . The thermoplastic resin composition as recited in  claim 11 , wherein said amount of extracted alkalis further includes Ca: 10 ppm or below.  
     
     
         14 . A thermoplastic resin composition comprising: 
 (A) a synthetic resin having a melting temperature of 300° C. or above, and    (B) a flaky inorganic filler incorporated in the resin and having a pH of aqueous dispersion in the range of 5.5-8.0, and an amount of extracted alkalis: Na=30 ppm or below, and K=40 ppm or below.    
     
     
         15 . The thermoplastic resin composition as recited in  claim 14 , wherein said flaky inorganic filler comprises one or more of substances selected from the group consisting of flaky titanate compounds, mica, sericite, illite, talc, kaolinite, montmorillonite, boehmite, γ-alumina and α-alumina.  
     
     
         16 . The thermoplastic resin composition as recited in  claim 14 , wherein said flaky inorganic filler is an inorganic filler treated with an inorganic or organic acid to remove the extractable alkalis and/or heat treated at 600-1,300° C.  
     
     
         17 . A thermoplastic resin composition comprising: 
 (A) a thermoplastic resin having a melting temperature of 300° C. or above; and    (B) a synthetic mica incorporated in the resin and having a maximum diameter a of 20 μm or below, a thickness b of 0.05-1.0 μm and an aspect ratio of 20 or above,    wherein said thermoplastic resin composition has thermal plasticity.    
     
     
         18 . The thermoplastic resin composition as recited in  claim 11 , wherein said thermoplastic resin having a melting temperature of 300° C. or above comprises one or more substances selected from the group consisting of polyallyl ether ketone, polyetherimide, thermoplastic polyimide, polyallylate, aromatic polysulfone and liquid crystal polymer.  
     
     
         19 . The thermoplastic resin composition as recited in  claim 11 , wherein said resin composition is a resin composition useful for formation into a heat-resistant film for a flexible printed circuit board.  
     
     
         20 . The thermoplastic resin composition as recited in  claim 14 , wherein said synthetic resin having a melting temperature of 300° C. or above comprises one or more substances selected from the group consisting of polyallyl ether ketone, polyetherimide, thermoplastic polyimide, polyallylate, aromatic polysulfone and liquid crystal polymer.  
     
     
         21 . The thermoplastic resin composition as recited in  claim 14 , wherein said resin composition is a resin composition useful for formation into a heat-resistant film for a flexible printed circuit board.  
     
     
         22 . The thermoplastic resin composition as recited in  claim 17 , wherein said thermoplastic resin having a melting temperature of 300° C. or above comprises one or more substances selected from the group consisting of polyallyl ether ketone, polyetherimide, thermoplastic polyimide, polyallylate, aromatic polysulfone and liquid crystal polymer.  
     
     
         23 . The thermoplastic resin composition as recited in  claim 17 , wherein said thermoplastic resin composition is a thermoplastic resin composition useful for formation into a heat-resistant film for a flexible printed circuit board.