Inventor · disambiguated record
Daewook Yang
Also filed as: YANG DAEWOOK
8 granted patents·27 citations·filing 2008–2013
81Inventor score
Top patents by PatentIndex Score
8 records- 0186US8421201B2Integrated circuit packaging system with underfill and methods of manufacture thereofLEE KYUNGHOON·Filed 2009·Granted Apr 16, 2013·13 cites·16 claims
- 0284US8409918B2Semiconductor device and method of forming pre-molded substrate to reduce warpage during die mountingYANG DAEWOOK·Filed 2010·Granted Apr 2, 2013·9 cites·22 claims
- 0362US9053953B1Integrated circuit packaging system with underfill and method of manufacture thereofLEE KYUNGHOON·Filed 2013·Granted Jun 9, 2015·1 cites·20 claims
- 0461US8836097B2Semiconductor device and method of forming pre-molded substrate to reduce warpage during die moldingSTATS CHIPPAC LTD·Filed 2013·Granted Sep 16, 2014·1 cites·26 claims
- 0559US8936969B2Semiconductor device and method of singulating semiconductor wafer along modified region within non-active region formed by irradiating energy through mounting tapeLEE HUNTEAK·Filed 2012·Granted Jan 20, 2015·2 cites·24 claims
- 0659US8709877B2Integrated circuit packaging system with an encapsulation and method of manufacture thereofYANG DAEWOOK·Filed 2012·Granted Apr 29, 2014·1 cites·20 claims
- 0745US8841782B2Integrated circuit package system with mold gateYANG DAEWOOK·Filed 2008·Granted Sep 23, 2014·0 cites·20 claims
- 0840US8716108B2Integrated circuit packaging system with ultra-thin chip and method of manufacture thereofLEE HUN TEAK·Filed 2012·Granted May 6, 2014·0 cites·14 claims
Join the waitlist — get patent alerts
Get an alert when Daewook Yang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →