Inventor · disambiguated record
Sung-Min Sim
Also filed as: SIM SUNG M · SIM SUNG-MIN
14 granted patents·9 pending applications·694 citations·filing 1994–2008
94Inventor score
Top patents by PatentIndex Score
23 records- 0197US7151009B2Method for manufacturing wafer level chip stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 19, 2006·356 cites·20 claims
- 0294US5753532AMethod of manufacturing semiconductor chip packageSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted May 19, 1998·197 cites·11 claims
- 0388US7307342B2Interconnection structure of integrated circuit chipSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 11, 2007·16 cites·19 claims
- 0485US7205660B2Wafer level chip scale package having a gap and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 17, 2007·12 cites·10 claims
- 0576US7855144B2Method of forming metal lines and bumps for semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Dec 21, 2010·7 cites·15 claims
- 0676US7312143B2Wafer level chip scale package having a gap and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 25, 2007·6 cites·10 claims
- 0770US5840614AMethod of producing a semiconductor wafer using ultraviolet sensitive tapeSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Nov 24, 1998·40 cites·6 claims
- 0867US7524763B2Fabrication method of wafer level chip scale packagesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 28, 2009·4 cites·12 claims
- 0964US7732319B2Interconnection structure of integrated circuit chipSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 8, 2010·2 cites·16 claims
- 1063US6423654B1Method of manufacturing a semiconductor device having silicon oxynitride passavation layerSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jul 23, 2002·10 cites·7 claims
- 1162US5543493AMethod for treating a polyimide surfaceSAMSUNG ELECTRONICS CO LTD·Filed 1994·Granted Aug 6, 1996·17 cites·20 claims
- 1261US7825495B2Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Nov 2, 2010·2 cites·19 claims
- 1361US2009020878A1Semiconductor packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1447US2007200216A1Chip stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1546US5933708ALead-on-chip semiconductor package and method for making the sameSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Aug 3, 1999·13 cites·14 claims
- 1646US2009153171A1Apparatus for testing objects under controlled conditionsLEE SANG-SIK·Filed 2008·Application pending·0 cites
- 1745US2008185738A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1844US5633206AProcess for manufacturing lead frame for semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 1995·Granted May 27, 1997·12 cites·5 claims
- 1943US2007164431A1Wafer level chip scale package having rerouting layer and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2043US2006019467A1Methods of fabricating integrated circuit chips for multi-chip packaging and wafers and chips formed therebyLEE IN-YOUNG·Filed 2005·Application pending·0 cites
- 2142US2007069320A1Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2240US2006038291A1Electrode structure of a semiconductor device and method of manufacturing the sameCHUNG HYUN-SOO·Filed 2005·Application pending·0 cites
- 2336US2006073704A1Method of forming bump that may reduce possibility of losing contact pad materialJEONG SE-YOUNG·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Sung-Min Sim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →