Inventor · disambiguated record
Jeffery D. Bielefeld
Also filed as: BIELEFELD JEFFERY · BIELEFELD JEFFERY D
22 granted patents·13 pending applications·106 citations·filing 2001–2024
93Inventor score
Top patents by PatentIndex Score
35 records- 0198US11444024B2Subtractively patterned interconnect structures for integrated circuitsINTEL CORP·Filed 2020·Granted Sep 13, 2022·10 cites·30 claims
- 0296US11437283B2Backside contacts for semiconductor devicesINTEL CORP·Filed 2019·Granted Sep 6, 2022·12 cites·25 claims
- 0395US12027458B2Subtractively patterned interconnect structures for integrated circuitsINTEL CORP·Filed 2022·Granted Jul 2, 2024·2 cites·20 claims
- 0493US10868246B2Conductive bridge random access memory (CBRAM) devices with low thermal conductivity electrolyte sublayerINTEL CORP·Filed 2016·Granted Dec 15, 2020·15 cites·23 claims
- 0592US7772702B2Dielectric spacers for metal interconnects and method to form the sameINTEL CORP·Filed 2006·Granted Aug 10, 2010·25 cites·23 claims
- 0687US8461683B2Self-forming, self-aligned barriers for back-end interconnects and methods of making sameYOO HUI JAE·Filed 2011·Granted Jun 11, 2013·9 cites·17 claims
- 0785US12394716B2Integrated circuit interconnect structures with graphene capINTEL CORP·Filed 2021·Granted Aug 19, 2025·1 cites·19 claims
- 0883US12482744B2Subtractively patterned interconnect structures for integrated circuitsINTEL CORP·Filed 2024·Granted Nov 25, 2025·0 cites·19 claims
- 0983US6677253B2Carbon doped oxide depositionINTEL CORP·Filed 2001·Granted Jan 13, 2004·25 cites·16 claims
- 1082US11011463B2Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication and structures resulting therefromINTEL CORP·Filed 2016·Granted May 18, 2021·3 cites·20 claims
- 1182US2024203786A1Self-forming, self-aligned barriers for back-end interconnects and methods of making sameTAHOE RES LTD·Filed 2024·Application pending·0 cites
- 1269US9269652B2Chemically altered carbosilanes for pore sealing applicationsMICHALAK DAVID J·Filed 2011·Granted Feb 23, 2016·2 cites·18 claims
- 1368US10665781B2Programmable metallization cell with alloy layerINTEL CORP·Filed 2016·Granted May 26, 2020·1 cites·22 claims
- 1467US2025108459A1Protective debonding stack for selective transferINTEL CORP·Filed 2023·Application pending·0 cites
- 1566US11990403B2Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication and structures resulting therefromINTEL CORP·Filed 2021·Granted May 21, 2024·0 cites·6 claims
- 1665US11887887B2Interconnect structures and methods of fabricationINTEL CORP·Filed 2022·Granted Jan 30, 2024·0 cites·18 claims
- 1762US10483160B2Ultra thin helmet dielectric layer for maskless air gap and replacement ILD processesINTEL CORP·Filed 2015·Granted Nov 19, 2019·1 cites·20 claims
- 1858US2025300129A1Integrated circuit packages including multi-die stacks having tapered sidewallsINTEL CORP·Filed 2024·Application pending·0 cites
- 1957US2025210411A1Interconnect layers with air gapsINTEL CORP·Filed 2023·Application pending·0 cites
- 2057US2025112155A1Conformal coatings with spatially defined surface energies for die-to-wafer self-alignment assisted assemblyINTEL CORP·Filed 2023·Application pending·0 cites
- 2155US11404307B2Interconnect structures and methods of fabricationINTEL CORP·Filed 2019·Granted Aug 2, 2022·0 cites·18 claims
- 2255US2016307796A1Self-forming, self-aligned barriers for back-end interconnects and methods of making sameINTEL CORP·Filed 2016·Application pending·0 cites
- 2352US11406972B2Activation of protected cross-linking catalysts during formation of dielectric materialsINTEL CORP·Filed 2015·Granted Aug 9, 2022·0 cites·9 claims
- 2452US2024063071A1Inorganic material deposition for inter-die fill in multi-chip composite structuresINTEL CORP·Filed 2022·Application pending·0 cites
- 2551US2023197836A1Integrated circuits with max or mx conductive materialsINTEL CORP·Filed 2021·Application pending·0 cites
- 2650US2023187395A1Oxide and carbon layers at a surface of a substrate for hybrid bondingINTEL CORP·Filed 2021·Application pending·0 cites
- 2750US2024332166A1Integrated circuit structures having air gapsINTEL CORP·Filed 2023·Application pending·0 cites
- 2847US11424160B2Self-aligned local interconnectsINTEL CORP·Filed 2019·Granted Aug 23, 2022·0 cites·25 claims
- 2946US11532558B2Metallization barrier structures for bonded integrated circuit interfacesINTEL CORP·Filed 2019·Granted Dec 20, 2022·0 cites·20 claims
- 3045US11152254B2Pitch quartered three-dimensional air gapsINTEL CORP·Filed 2016·Granted Oct 19, 2021·0 cites·9 claims
- 3145US11024538B2Hardened plug for improved shorting marginINTEL CORP·Filed 2016·Granted Jun 1, 2021·0 cites·18 claims
- 3241US2004043555A1Carbon doped oxide depositionFiled 2003·Application pending·0 cites
- 3340US2009001594A1Airgap interconnect systemYOO HUI JAE·Filed 2007·Application pending·0 cites
- 3439US10529660B2Pore-filled dielectric materials for semiconductor structure fabrication and their methods of fabricationINTEL CORP·Filed 2016·Granted Jan 7, 2020·0 cites·5 claims
- 3539US2006105581A1Glycol doping agents in carbon doped oxide filmsBIELEFELD JEFFERY D·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jeffery D. Bielefeld files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →