Inventor · disambiguated record
Seungyong Chai
Also filed as: CHAI SEUNGYONG
10 granted patents·1 pending application·16 citations·filing 2007–2018
83Inventor score
Top patents by PatentIndex Score
11 records- 0188US9997468B2Integrated circuit packaging system with shielding and method of manufacturing thereofSTATS CHIPPAC PTE LTD·Filed 2016·Granted Jun 12, 2018·5 cites·20 claims
- 0278US9412624B1Integrated circuit packaging system with substrate and method of manufacture thereofCUONG DAO NGUYEN PHU·Filed 2014·Granted Aug 9, 2016·6 cites·20 claims
- 0373US8524537B2Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residueYUN JAEUN·Filed 2010·Granted Sep 3, 2013·4 cites·28 claims
- 0462US9279673B2Semiconductor device and method of calibrating warpage testing system to accurately measure semiconductor package warpageSTATS CHIPPAC LTD·Filed 2013·Granted Mar 8, 2016·1 cites·25 claims
- 0558US11145603B2Integrated circuit packaging system with shielding and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2018·Granted Oct 12, 2021·0 cites·16 claims
- 0658US11024585B2Integrated circuit packaging system with shielding and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2018·Granted Jun 1, 2021·0 cites·20 claims
- 0749US10109587B1Integrated circuit packaging system with substrate and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2016·Granted Oct 23, 2018·0 cites·20 claims
- 0846US2013256840A1Semiconductor Device and Method of Forming Protective Coating Material Over Semiconductor Wafer to Reduce Lamination Tape ResidueSTATS CHIPPAC LTD·Filed 2013·Application pending·0 cites
- 0944US8067275B2Integrated circuit package system with package integrationKO WONJUN·Filed 2007·Granted Nov 29, 2011·0 cites·20 claims
- 1043US10319684B2Dummy conductive structures for EMI shieldingSTATS CHIPPAC PTE LTD·Filed 2017·Granted Jun 11, 2019·0 cites·20 claims
- 1142US8518822B2Integrated circuit packaging system with multi-stacked flip chips and method of manufacture thereofCHAI SEUNGYONG·Filed 2009·Granted Aug 27, 2013·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →