Inventor · disambiguated record
Kuniharu Muto
Also filed as: MUTO KUNIHARU
13 granted patents·7 pending applications·97 citations·filing 1995–2023
91Inventor score
Top patents by PatentIndex Score
20 records- 0192US10811345B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Oct 20, 2020·8 cites·15 claims
- 0287US10566258B2Method of packaging power semiconductor module including power transistorsRENESAS ELECTRONICS CORP·Filed 2018·Granted Feb 18, 2020·5 cites·14 claims
- 0379US10128200B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 13, 2018·2 cites·16 claims
- 0478US9906165B2Semiconductor moduleRENESAS ELECTRONICS CORP·Filed 2016·Granted Feb 27, 2018·3 cites·16 claims
- 0578US5808359ASemiconductor device having a heat sink with bumpers for protecting outer leadsHITACHI LTD·Filed 1995·Granted Sep 15, 1998·40 cites·6 claims
- 0677US7667307B2Semiconductor deviceRENESAS TECH CORP·Filed 2008·Granted Feb 23, 2010·5 cites·2 claims
- 0773US10284109B2Power module having control substrate mounted above power substrate with control substrate drivers located between the power substrate power transistorsRENESAS ELECTRONICS CORP·Filed 2018·Granted May 7, 2019·2 cites·11 claims
- 0871US6492739B2Semiconductor device having bumper portions integral with a heat sinkHITACHI LTD·Filed 2002·Granted Dec 10, 2002·12 cites·7 claims
- 0962US6320270B1Semiconductor device and method of producing the sameHITACHI LTD·Filed 2000·Granted Nov 20, 2001·7 cites·4 claims
- 1058US11037847B2Method of manufacturing semiconductor module and semiconductor moduleRENESAS ELECTRONICS CORP·Filed 2020·Granted Jun 15, 2021·0 cites·3 claims
- 1155US10573604B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Feb 25, 2020·0 cites·5 claims
- 1255US6392308B2Semiconductor device having bumper portions integral with a heat sinkHITACHI LTD·Filed 2001·Granted May 21, 2002·4 cites·6 claims
- 1355US2023369179A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1454US2013207252A1Semiconductor DeviceRENESAS ELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 1551US2012034742A1Semiconductor deviceMUTO KUNIHARU·Filed 2011·Application pending·0 cites
- 1649US2010105174A1Semiconductor deviceRENESAS TECH CORP·Filed 2010·Application pending·0 cites
- 1747US2018138828A1Semiconductor moduleRENESAS ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 1847US2009218676A1Semiconductor deviceRENESAS TECH CORP·Filed 2009·Application pending·0 cites
- 1946US6104085ASemiconductor device and method of producing the sameHITACHI LTD·Filed 1999·Granted Aug 15, 2000·9 cites·11 claims
- 2033US2010181628A1Semiconductor deviceRENESAS TECH CORP·Filed 2010·Application pending·0 cites
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