Inventor · disambiguated record
Jae Han Chung
Also filed as: CHUNG JAE HAN
19 granted patents·5 pending applications·61 citations·filing 2005–2024
92Inventor score
Top patents by PatentIndex Score
24 records- 0186US7445962B2Stacked integrated circuits package system with dense routability and high thermal conductivitySTATS CHIPPAC LTD·Filed 2005·Granted Nov 4, 2008·21 cites·20 claims
- 0280US10047910B2Apparatus for fastening gas vessel and manufacturing method of the sameHYUNDAI MOTOR CO LTD·Filed 2016·Granted Aug 14, 2018·2 cites·20 claims
- 0379US11085584B2High-pressure composite container having gastight nozzle structureHYUNDAI MOTOR CO LTD·Filed 2016·Granted Aug 10, 2021·2 cites·6 claims
- 0476US11271225B2Thermal-activated pressure relief device for fuel cell vehicleHYUNDAI MOTOR CO LTD·Filed 2019·Granted Mar 8, 2022·2 cites·9 claims
- 0576US7859099B2Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2008·Granted Dec 28, 2010·6 cites·20 claims
- 0675US12451500B2Hydrogen storage system and method for adjusting differential pressure thereinHYUNDAI MOTOR CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 0775US10274132B2Multi-sealed nozzle and pressure vessel including the sameHYUNDAI MOTOR CO LTD·Filed 2016·Granted Apr 30, 2019·2 cites·20 claims
- 0874US8247894B2Integrated circuit package system with step mold recessYOON IN SANG·Filed 2008·Granted Aug 21, 2012·6 cites·20 claims
- 0972US8710634B2Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereofCHI HEEJO·Filed 2009·Granted Apr 29, 2014·6 cites·12 claims
- 1071US8067831B2Integrated circuit package system with planar interconnectsKWON HYEOG CHAN·Filed 2005·Granted Nov 29, 2011·6 cites·20 claims
- 1170US11331691B2Apparatus and method of manufacturing tow prepregHYUNDAI MOTOR CO LTD·Filed 2017·Granted May 17, 2022·2 cites·12 claims
- 1267US9142481B2Integrated circuit packaging system with heatsink cap and method of manufacture thereofKIM GWANGJIN·Filed 2012·Granted Sep 22, 2015·4 cites·9 claims
- 1366US2025314356A1Pressure vesselHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 1460US9093415B2Integrated circuit packaging system with heat spreader and method of manufacture thereofKIM OH HAN·Filed 2013·Granted Jul 28, 2015·1 cites·20 claims
- 1558US7687920B2Integrated circuit package-on-package system with central bond wiresSTATS CHIPPAC LTD·Filed 2008·Granted Mar 30, 2010·1 cites·22 claims
- 1653US9656543B2Fuel gas tank manufacturing methodHYUNDAI MOTOR CO LTD·Filed 2015·Granted May 23, 2017·0 cites·4 claims
- 1749US10767814B2Pressure vessel equipped with permeated gas discharging structureHYUNDAI MOTOR CO LTD·Filed 2017·Granted Sep 8, 2020·0 cites·10 claims
- 1848US7875967B2Integrated circuit with step molded inner stacking module package in package systemSTATS CHIPPAC LTD·Filed 2008·Granted Jan 25, 2011·0 cites·20 claims
- 1947US8093100B2Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereofCHOI A LEAM·Filed 2010·Granted Jan 10, 2012·0 cites·20 claims
- 2044US2009127715A1Mountable integrated circuit package system with protrusionSHIN HANGIL·Filed 2007·Application pending·0 cites
- 2143US9656612B2Apparatus for fastening pressure vessel of vehicle and pressure vessel fastening systemHYUNDAI MOTOR CO LTD·Filed 2015·Granted May 23, 2017·0 cites·10 claims
- 2243US2008315406A1Integrated circuit package system with cavity substrateCHUNG JAE HAN·Filed 2007·Application pending·0 cites
- 2339US2018274725A1High-pressure tank having structure for radiation of heat and discharge of remaining gas and method of manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2017·Application pending·0 cites
- 2437US2012223435A1Integrated circuit packaging system with leads and method of manufacture thereofCHOI A LEAM·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →