Assignee
CHI HEEJO
KR·24 granted patents·3 pending applications·399 citations·filing 2009–2015
Top patents by PatentIndex Score
27 records- 0198US9735113B2Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSPCHI HEEJO·Filed 2010·Granted Aug 15, 2017·60 cites·6 claims
- 0298US8288209B1Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor dieCHI HEEJO·Filed 2011·Granted Oct 16, 2012·52 cites·20 claims
- 0398US8143097B2Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMPCHI HEEJO·Filed 2009·Granted Mar 27, 2012·80 cites·20 claims
- 0498US8138014B2Method of forming thin profile WLCSP with vertical interconnect over package footprintCHI HEEJO·Filed 2010·Granted Mar 20, 2012·42 cites·20 claims
- 0597US9048306B2Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMPCHI HEEJO·Filed 2012·Granted Jun 2, 2015·27 cites·8 claims
- 0695US8202797B2Integrated circuit system with recessed through silicon via pads and method of manufacture thereofCHI HEEJO·Filed 2010·Granted Jun 19, 2012·20 cites·20 claims
- 0794US8716065B2Integrated circuit packaging system with encapsulation and method of manufacture thereofCHI HEEJO·Filed 2011·Granted May 6, 2014·17 cites·20 claims
- 0892US9269595B2Semiconductor device with thin profile WLCSP with vertical interconnect over package footprintCHI HEEJO·Filed 2012·Granted Feb 23, 2016·11 cites·24 claims
- 0991US8421203B2Integrated circuit packaging system with foldable substrate and method of manufacture thereofCHI HEEJO·Filed 2010·Granted Apr 16, 2013·13 cites·11 claims
- 1089US8455300B2Integrated circuit package system with embedded die superstructure and method of manufacture thereofCHI HEEJO·Filed 2010·Granted Jun 4, 2013·12 cites·14 claims
- 1186US8421210B2Integrated circuit packaging system with dual side connection and method of manufacture thereofCHI HEEJO·Filed 2010·Granted Apr 16, 2013·9 cites·20 claims
- 1284US9558965B2Semiconductor device with thin profile WLCSP with vertical interconnect over package footprintCHI HEEJO·Filed 2012·Granted Jan 31, 2017·5 cites·19 claims
- 1383US9299650B1Integrated circuit packaging system with single metal layer interposer and method of manufacture thereofCHI HEEJO·Filed 2013·Granted Mar 29, 2016·6 cites·20 claims
- 1481US8749040B2Integrated circuit packaging system with package-on-package and method of manufacture thereofCHI HEEJO·Filed 2009·Granted Jun 10, 2014·9 cites·9 claims
- 1580US8492888B2Integrated circuit packaging system with stiffener and method of manufacture thereofCHI HEEJO·Filed 2011·Granted Jul 23, 2013·5 cites·20 claims
- 1679US8587129B2Integrated circuit packaging system with through silicon via base and method of manufacture thereofCHI HEEJO·Filed 2009·Granted Nov 19, 2013·8 cites·20 claims
- 1779US8314486B2Integrated circuit packaging system with shield and method of manufacture thereofCHI HEEJO·Filed 2010·Granted Nov 20, 2012·5 cites·20 claims
- 1876US9502267B1Integrated circuit packaging system with support structure and method of manufacture thereofCHI HEEJO·Filed 2014·Granted Nov 22, 2016·4 cites·20 claims
- 1976US8624370B2Integrated circuit packaging system with an interposer and method of manufacture thereofCHI HEEJO·Filed 2009·Granted Jan 7, 2014·6 cites·20 claims
- 2072US8710634B2Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereofCHI HEEJO·Filed 2009·Granted Apr 29, 2014·6 cites·12 claims
- 2163US8901755B2Semiconductor device and method of forming conductive layer over metal substrate for electrical interconnect of semiconductor dieCHI HEEJO·Filed 2012·Granted Dec 2, 2014·1 cites·25 claims
- 2262US9406642B1Integrated circuit packaging system with insulated trace and method of manufacture thereofCHI HEEJO·Filed 2015·Granted Aug 2, 2016·1 cites·17 claims
- 2348US8426955B2Integrated circuit packaging system with a stack package and method of manufacture thereofCHI HEEJO·Filed 2009·Granted Apr 23, 2013·0 cites·18 claims
- 2447US9673171B1Integrated circuit packaging system with coreless substrate and method of manufacture thereofCHI HEEJO·Filed 2014·Granted Jun 6, 2017·0 cites·20 claims
- 2547US2010237481A1Integrated circuit packaging system with dual sided connection and method of manufacture thereofCHI HEEJO·Filed 2009·Application pending·0 cites
- 2640US2012319295A1Integrated circuit packaging system with pads and method of manufacture thereofCHI HEEJO·Filed 2011·Application pending·0 cites
- 2738US2011215450A1Integrated circuit packaging system with encapsulation and method of manufacture thereofCHI HEEJO·Filed 2010·Application pending·0 cites
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