Inventor · disambiguated record
Hyeong-No Kim
Also filed as: KIM HYEONG-NO
7 granted patents·2 pending applications·63 citations·filing 2003–2014
83Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0186US6773961B1Singulation method used in leadless packaging processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Aug 10, 2004·42 cites·18 claims
- 0267US7939379B2Hybrid carrier and a method for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted May 10, 2011·5 cites·25 claims
- 0367US7830024B2Package and fabricating method thereofADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Nov 9, 2010·4 cites·6 claims
- 0460US7205658B2Singulation method used in leadless packaging processADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Apr 17, 2007·8 cites·11 claims
- 0557US7964953B2Stacked type chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Jun 21, 2011·1 cites·16 claims
- 0655US8866280B2Chip packageCHOI SOO-MIN·Filed 2009·Granted Oct 21, 2014·3 cites·7 claims
- 0747US7701046B2Stacked type chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Apr 20, 2010·0 cites·12 claims
- 0845US2014346654A1Chip packageADVANCED SEMICONDUCTOR ENG·Filed 2014·Application pending·0 cites
- 0940US2008128890A1Chip package and fabricating process thereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hyeong-No Kim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →