Inventor · disambiguated record
Robin Cheung
Also filed as: CHEUNG ROBIN · CHEUNG ROBIN W · RAVINOVICH EUGENE
102 granted patents·17 pending applications·6,126 citations·filing 1984–2018
99Inventor score
Files withADVANCED MICRO DEVICES INC63APPLIED MATERIALS INC34UNITY SEMICONDUCTOR CORP6RINERSON DARRELL4CHEUNG ROBIN3
Top patents by PatentIndex Score
119 records- 0198US6258220B1Electro-chemical deposition systemAPPLIED MATERIALS INC·Filed 1999·Granted Jul 10, 2001·443 cites·26 claims
- 0298US6258223B1In-situ electroless copper seed layer enhancement in an electroplating systemAPPLIED MATERIALS INC·Filed 1999·Granted Jul 10, 2001·399 cites·9 claims
- 0398US6136163AApparatus for electro-chemical deposition with thermal anneal chamberAPPLIED MATERIALS INC·Filed 1999·Granted Oct 24, 2000·569 cites·14 claims
- 0498US5972192APulse electroplating copper or copper alloysADVANCED MICRO DEVICES INC·Filed 1997·Granted Oct 26, 1999·381 cites·16 claims
- 0598US5635423ASimplified dual damascene process for multi-level metallization and interconnection structureADVANCED MICRO DEVICES INC·Filed 1994·Granted Jun 3, 1997·374 cites·13 claims
- 0697US7888711B2Continuous plane of thin-film materials for a two-terminal cross-point memoryUNITY SEMICONDUCTOR CORP·Filed 2010·Granted Feb 15, 2011·41 cites·20 claims
- 0797US7742323B2Continuous plane of thin-film materials for a two-terminal cross-point memoryUNITY SEMICONDUCTOR CORP·Filed 2007·Granted Jun 22, 2010·56 cites·31 claims
- 0897US6645550B1Method of treating a substrateAPPLIED MATERIALS INC·Filed 2000·Granted Nov 11, 2003·249 cites·17 claims
- 0997US6245670B1Method for filling a dual damascene opening having high aspect ratio to minimize electromigration failureADVANCED MICRO DEVICES INC·Filed 1999·Granted Jun 12, 2001·287 cites·8 claims
- 1096US6436267B1Method for achieving copper fill of high aspect ratio interconnect featuresAPPLIED MATERIALS INC·Filed 2000·Granted Aug 20, 2002·105 cites·35 claims
- 1195US8003511B2Memory cell formation using ion implant isolated conductive metal oxideUNITY SEMICONDUCTOR CORP·Filed 2009·Granted Aug 23, 2011·26 cites·43 claims
- 1295US7897951B2Continuous plane of thin-film materials for a two-terminal cross-point memoryUNITY SEMICONDUCTOR CORP·Filed 2007·Granted Mar 1, 2011·27 cites·14 claims
- 1395US6259160B1Apparatus and method of encapsulated copper (Cu) Interconnect formationADVANCED MICRO DEVICES INC·Filed 1999·Granted Jul 10, 2001·162 cites·6 claims
- 1495US5550405AProcessing techniques for achieving production-worthy, low dielectric, low interconnect resistance and high performance ICSADVANCED MICRO DEVICES INC·Filed 1994·Granted Aug 27, 1996·149 cites·10 claims
- 1594US5968333AMethod of electroplating a copper or copper alloy interconnectADVANCED MICRO DEVICES INC·Filed 1998·Granted Oct 19, 1999·153 cites·14 claims
- 1694US5679608AProcessing techniques for achieving production-worthy, low dielectric, low dielectric, low interconnect resistance and high performance ICADVANCED MICRO DEVICES INC·Filed 1995·Granted Oct 21, 1997·140 cites·16 claims
- 1794US5559055AMethod of decreased interlayer dielectric constant in a multilayer interconnect structure to increase device speed performanceADVANCED MICRO DEVICES INC·Filed 1994·Granted Sep 24, 1996·173 cites·17 claims
- 1892US6740221B2Method of forming copper interconnectsAPPLIED MATERIALS INC·Filed 2001·Granted May 25, 2004·56 cites·35 claims
- 1992US5654589ALanding pad technology doubled up as local interconnect and borderless contact for deep sub-half micrometer IC applicationADVANCED MICRO DEVICES INC·Filed 1995·Granted Aug 5, 1997·96 cites·13 claims
- 2091US6635157B2Electro-chemical deposition systemAPPLIED MATERIALS INC·Filed 2001·Granted Oct 21, 2003·43 cites·68 claims
- 2191US6056864AElectropolishing copper film to enhance CMP throughputADVANCED MICRO DEVICES INC·Filed 1998·Granted May 2, 2000·117 cites·17 claims
- 2290US8317910B2Immersion platinum plating solutionCHEUNG ROBIN·Filed 2010·Granted Nov 27, 2012·7 cites·13 claims
- 2390US6357143B2Method and apparatus for heating and cooling substratesAPPLIED MATERIALS INC·Filed 2001·Granted Mar 19, 2002·40 cites·40 claims
- 2490US5970370AManufacturing capping layer for the fabrication of cobalt salicide structuresADVANCED MICRO DEVICES INC·Filed 1998·Granted Oct 19, 1999·83 cites·29 claims
- 2589US6455415B1Method of encapsulated copper (Cu) interconnect formationADVANCED MICRO DEVICES INC·Filed 2001·Granted Sep 24, 2002·49 cites·8 claims
- 2688US8237142B2Continuous plane of thin-film materials for a two-terminal cross-point memoryCHEUNG ROBIN·Filed 2011·Granted Aug 7, 2012·11 cites·21 claims
- 2788US6153523AMethod of forming high density capping layers for copper interconnects with improved adhesionADVANCED MICRO DEVICES INC·Filed 1998·Granted Nov 28, 2000·90 cites·20 claims
- 2888US5674781ALanding pad technology doubled up as a local interconnect and borderless contact for deep sub-half micrometer IC applicationADVANCED MICRO DEVICES INC·Filed 1996·Granted Oct 7, 1997·69 cites·15 claims
- 2988US5670828ATunneling technology for reducing intra-conductive layer capacitanceADVANCED MICRO DEVICES INC·Filed 1995·Granted Sep 23, 1997·80 cites·21 claims
- 3088US5534731ALayered low dielectric constant technologyADVANCED MICRO DEVICES INC·Filed 1994·Granted Jul 9, 1996·82 cites·17 claims
- 3187US7497932B2Electro-chemical deposition systemAPPLIED MATERIALS INC·Filed 2006·Granted Mar 3, 2009·9 cites·4 claims
- 3287US6824666B2Electroless deposition method over sub-micron aperturesAPPLIED MATERIALS INC·Filed 2002·Granted Nov 30, 2004·42 cites·102 claims
- 3387US5785236AAdvanced copper interconnect system that is compatible with existing IC wire bonding technologyADVANCED MICRO DEVICES INC·Filed 1995·Granted Jul 28, 1998·89 cites·22 claims
- 3486US6658763B2Method for heating and cooling substratesAPPLIED MATERIALS INC·Filed 2002·Granted Dec 9, 2003·27 cites·18 claims
- 3586US6276072B1Method and apparatus for heating and cooling substratesAPPLIED MATERIALS INC·Filed 1999·Granted Aug 21, 2001·58 cites·34 claims
- 3686US4727045APlugged poly silicon resistor load for static random access memory cellsADVANCED MICRO DEVICES INC·Filed 1986·Granted Feb 23, 1988·51 cites·14 claims
- 3784US6818066B2Method and apparatus for treating a substrateAPPLIED MATERIALS INC·Filed 2001·Granted Nov 16, 2004·25 cites·13 claims
- 3884US6477787B2Method and apparatus for heating and cooling substratesAPPLIED MATERIALS INC·Filed 2002·Granted Nov 12, 2002·22 cites·43 claims
- 3984US6153521AMetallized interconnection structure and method of making the sameADVANCED MICRO DEVICES INC·Filed 1998·Granted Nov 28, 2000·62 cites·14 claims
- 4083US6929774B2Method and apparatus for heating and cooling substratesAPPLIED MATERIALS INC·Filed 2003·Granted Aug 16, 2005·19 cites·42 claims
- 4182US8569160B2Device fabricationRINERSON DARRELL·Filed 2012·Granted Oct 29, 2013·4 cites·25 claims
- 4281US5837618AUniform nonconformal deposition for forming low dielectric constant insulation between certain conductive linesADVANCED MICRO DEVICES INC·Filed 1997·Granted Nov 17, 1998·53 cites·9 claims
- 4380US6842659B2Method and apparatus for providing intra-tool monitoring and controlAPPLIED MATERIALS INC·Filed 2001·Granted Jan 11, 2005·18 cites·15 claims
- 4480US6239494B1Wire bonding CU interconnectsADVANCED MICRO DEVICES INC·Filed 1999·Granted May 29, 2001·55 cites·19 claims
- 4580US6096648ACopper/low dielectric interconnect formation with reduced electromigrationAMD·Filed 1999·Granted Aug 1, 2000·59 cites·18 claims
- 4680US5451545AProcess for forming stable local interconnect/active area silicide structure VLSI applicationsADVANCED MICRO DEVICES INC·Filed 1994·Granted Sep 19, 1995·54 cites·5 claims
- 4778US6400030B1Self-aligning vias for semiconductorsADVANCED MICRO DEVICES INC·Filed 2000·Granted Jun 4, 2002·21 cites·10 claims
- 4876US7393795B2Methods for post-etch deposition of a dielectric filmAPPLIED MATERIALS INC·Filed 2006·Granted Jul 1, 2008·5 cites·27 claims
- 4976US5776834ABias plasma deposition for selective low dielectric insulationADVANCED MICRO DEVICES INC·Filed 1995·Granted Jul 7, 1998·45 cites·10 claims
- 5076US5770519ACopper reservoir for reducing electromigration effects associated with a conductive via in a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 1995·Granted Jun 23, 1998·49 cites·19 claims
Showing the top 50 of 119 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →