Inventor · disambiguated record
Suk Chang Hong
Also filed as: HONG SUK-CHANG
10 granted patents·6 pending applications·25 citations·filing 2008–2024
83Inventor score
Top patents by PatentIndex Score
16 records- 0182US8942004B2Printed circuit board having electronic components embedded thereinHONG SUK CHANG·Filed 2010·Granted Jan 27, 2015·13 cites·10 claims
- 0278US10553452B2Printed circuit board, method, and semiconductor packageSAMSUNG ELECTRO MECH·Filed 2016·Granted Feb 4, 2020·4 cites·7 claims
- 0378US9392698B2Chip-embedded printed circuit board and semiconductor package using the PCB, and manufacturing method of the PCBSAMSUNG ELECTRO MECH·Filed 2013·Granted Jul 12, 2016·6 cites·9 claims
- 0471US11997788B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2022·Granted May 28, 2024·0 cites·34 claims
- 0571US2024276643A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 0669US12211816B2Printed circuit board and electronic component package including the sameSAMSUNG ELECTRO MECH·Filed 2022·Granted Jan 28, 2025·0 cites·20 claims
- 0768US10342135B2Printed circuit board and manufacturing method thereof, and semiconductor package including the printed circuit boardSAMSUNG ELECTRO MECH·Filed 2016·Granted Jul 2, 2019·2 cites·7 claims
- 0866US2023245989A1Printed circuit board and electronic component package including the sameSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 0962US12284758B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2023·Granted Apr 22, 2025·0 cites·24 claims
- 1058US12309923B2Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2022·Granted May 20, 2025·0 cites·35 claims
- 1157US12213251B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2022·Granted Jan 28, 2025·0 cites·18 claims
- 1251US12406918B2Printed circuit board and electronic component packageSAMSUNG ELECTRO MECH·Filed 2022·Granted Sep 2, 2025·0 cites·18 claims
- 1347US2015003020A1Electronic component-embedded printed circuit board having cooling memberC O SAMSUNG ELECTRO MECHANICS CO LTD·Filed 2014·Application pending·0 cites
- 1444US2010288535A1Electronic component-embedded printed circuit board comprising cooling member and method of manufacturing the sameHONG SUK CHANG·Filed 2009·Application pending·0 cites
- 1543US2014300001A1Printed circuit board and manufacturing method thereof, and semiconductor package including the printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1640US2009097220A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →