Printed circuit board and electronic component package including the same

Abstract

A printed circuit board includes: a first insulating layer; a first cavity disposed in one surface of the first insulating layer; a plurality of protrusion portions spaced apart from each other in the first cavity; and a first wiring layer embedded in the one surface of the first insulating layer.

What is claimed is: 
     
         1 . A printed circuit board comprising:
 a first insulating layer;   a first wiring layer embedded in one surface side of the first insulating layer, and having one surface exposed to the one surface of the first insulating layer; and   a cavity formed in the one surface of the first insulating layer;   wherein a roughness of bottom surface of the cavity is greater than a roughness of the one surface of the first wiring layer.   
     
     
         2 . The printed circuit board of  claim 1 , wherein a roughness of side surface of the cavity is greater than the roughness of the one surface of the first wiring layer. 
     
     
         3 . The printed circuit board of  claim 2 , wherein the roughness of the bottom surface of the cavity is substantially the same as the roughness of the side surface of the cavity. 
     
     
         4 . The printed circuit board of  claim 3 , wherein a roughness of the one surface of the first insulating layer is greater than the roughness of the one surface of the first wiring layer. 
     
     
         5 . The printed circuit board of  claim 1 , wherein a roughness of other surface of the first wiring layer is greater than the roughness of the one surface of the first wiring layer. 
     
     
         6 . The printed circuit board of  claim 1 , further comprising a connection pad disposed on the one surface of the first insulating layer,
 wherein the connection pad covers at least a portion of the one surface of the first wiring layer.   
     
     
         7 . The printed circuit board of  claim 1 , further comprising:
 a second wiring layer disposed on other surface opposing the one surface of the first insulating layer;   a first via layer penetrating through at least a portion of the first insulating layer to connect the first wiring layer and the second wiring layer each other;   a second insulating layer disposed on the other surface of the first insulating layer, and embedding the second wiring layer in one surface side;   a third wiring layer disposed on other surface opposing the one surface of the second insulating layer; and   a second via layer penetrating through at least a portion of the second insulating layer to connect the second wiring layer and the third wiring layer each other.   
     
     
         8 . The printed circuit board of  claim 7 , further comprising a solder resist layer disposed on the one surface of the first insulating layer and the other surface of the second insulating layer, respectively.