Inventor · disambiguated record
Yoshiya Hagimoto
Also filed as: HAGIMOTO YOSHIYA
39 granted patents·6 pending applications·141 citations·filing 2002–2025
97Inventor score
Files withSONY CORP25SONY SEMICONDUCTOR SOLUTIONS CORP12SONY GROUP CORP3SHIKI YOSHIMICHI2KAGAWA YOSHIHISA1
Top patents by PatentIndex Score
45 records- 0196US8896125B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusKAGAWA YOSHIHISA·Filed 2012·Granted Nov 25, 2014·26 cites·36 claims
- 0295US10431621B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusSONY CORP·Filed 2018·Granted Oct 1, 2019·7 cites·26 claims
- 0395US9147650B2Semiconductor device, method for manufacturing semiconductor device, and electronic apparatusSONY CORP·Filed 2013·Granted Sep 29, 2015·16 cites·16 claims
- 0494US10515988B2Solid-state image sensing device and electronic deviceSONY CORP·Filed 2016·Granted Dec 24, 2019·10 cites·17 claims
- 0594US9443802B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusSONY CORP·Filed 2015·Granted Sep 13, 2016·7 cites·24 claims
- 0693US9111763B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusSONY CORP·Filed 2014·Granted Aug 18, 2015·9 cites·17 claims
- 0792US10485293B2Semiconductor device and electronic apparatus with metal-containing film layer at bonding surface thereofSONY CORP·Filed 2017·Granted Nov 26, 2019·6 cites·20 claims
- 0891US10026769B2Semiconductor device and solid-state imaging deviceSONY CORP·Filed 2014·Granted Jul 17, 2018·12 cites·14 claims
- 0989US11031431B2Semiconductor device, method of manufacturing semiconductor device, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Jun 8, 2021·5 cites·14 claims
- 1087US10038024B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusSONY CORP·Filed 2016·Granted Jul 31, 2018·3 cites·15 claims
- 1187US9190275B2Bonding substrates with electrical connection through insulating filmSONY CORP·Filed 2014·Granted Nov 17, 2015·5 cites·18 claims
- 1286US10985102B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusSONY CORP·Filed 2019·Granted Apr 20, 2021·2 cites·17 claims
- 1385US11194135B2Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Dec 7, 2021·2 cites·8 claims
- 1483US10753551B2Electronic component, electronic component mounting substrate, and electronic component mounting method to facilitate positional alignment between the electronic component and the mounting substrateSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Aug 25, 2020·4 cites·5 claims
- 1583US9911778B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusSONY CORP·Filed 2016·Granted Mar 6, 2018·2 cites·12 claims
- 1681US10379323B2Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Aug 13, 2019·1 cites·21 claims
- 1781US9666627B2Electronic apparatus and manufacturing method for an electronic apparatus having multiple substrates directly electrically connected through an insulating filmSONY CORP·Filed 2015·Granted May 30, 2017·2 cites·20 claims
- 1880US11742374B2Semiconductor device, method of manufacturing semiconductor device, and imaging elementSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Aug 29, 2023·2 cites·10 claims
- 1980US7994603B2Semiconductor device and a method of manufacturing the sameSONY CORP·Filed 2008·Granted Aug 9, 2011·7 cites·1 claims
- 2078US11569123B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusSONY CORP·Filed 2021·Granted Jan 31, 2023·0 cites·17 claims
- 2178US11525984B2Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Dec 13, 2022·0 cites·14 claims
- 2278US9716076B2Method for manufacturing semiconductor device with metal-containing film layer at bonding surface thereofSONY CORP·Filed 2015·Granted Jul 25, 2017·2 cites·17 claims
- 2377US11107855B2Method for bonding and connecting substratesSONY CORP·Filed 2019·Granted Aug 31, 2021·1 cites·20 claims
- 2476US10707258B2Semiconductor device with multiple substrates electrically connected through an insulating filmSONY CORP·Filed 2018·Granted Jul 7, 2020·1 cites·19 claims
- 2576US9362106B2Substrate processing method, substrate processing apparatus, and storage mediumSONY CORP·Filed 2013·Granted Jun 7, 2016·4 cites·8 claims
- 2675US10134795B2Semiconductor device with multiple substrates electrically connected through an insulating film and manufacturing methodSONY CORP·Filed 2017·Granted Nov 20, 2018·1 cites·7 claims
- 2775US2021366958A1Semiconductor device and manufacturing methodSONY GROUP CORP·Filed 2021·Application pending·0 cites
- 2874US12294010B2Solid-state image sensing device and electronic deviceSONY GROUP CORP·Filed 2023·Granted May 6, 2025·0 cites·15 claims
- 2972US12199123B2Semiconductor device including a structure for higher integrationSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Granted Jan 14, 2025·0 cites·10 claims
- 3072US11329077B2Semiconductor device with a through electrode reception part wider than a through electrode, solid-state imaging device, and electronic equipmentSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted May 10, 2022·1 cites·9 claims
- 3171US2025267971A1Imaging device, electronic device, and manufacturing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2025·Application pending·0 cites
- 3270US10804313B2Semiconductor device and solid-state imaging deviceSONY CORP·Filed 2018·Granted Oct 13, 2020·1 cites·12 claims
- 3368US11637135B2Solid-state image sensing device and electronic deviceSONY GROUP CORP·Filed 2021·Granted Apr 25, 2023·0 cites·17 claims
- 3465US11217612B2Solid-state image sensing device and electronic deviceSONY CORP·Filed 2019·Granted Jan 4, 2022·0 cites·20 claims
- 3564US12324267B2Imaging device, electronic device, and manufacturing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted Jun 3, 2025·0 cites·20 claims
- 3664US9263496B2Method of manufacturing an image sensor by joining a pixel circuit substrate and a logic circuit substrate and thereafter thinning the pixel circuit substrateSONY CORP·Filed 2013·Granted Feb 16, 2016·0 cites·15 claims
- 3762US2022005853A1Semiconductor device, solid-state imaging device, and electronic equipmentSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Application pending·0 cites
- 3856US9941326B2Method of manufacturing an image sensor by joining a pixel circuit substrate and a logic circuit substrate and thereafter thinning the pixel circuit substrateSONY CORP·Filed 2016·Granted Apr 10, 2018·0 cites·21 claims
- 3953US10998300B2Display unitSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2015·Granted May 4, 2021·1 cites·19 claims
- 4053US8088693B2Substrate treatment methodSHIKI YOSHIMICHI·Filed 2006·Granted Jan 3, 2012·1 cites·11 claims
- 4149US2014240370A1Display, method of manufacturing display, method of driving display, and electronic apparatusSONY CORP·Filed 2014·Application pending·0 cites
- 4245US8367503B2Semiconductor device and a method of manufacturing the sameSONY CORP·Filed 2011·Granted Feb 5, 2013·0 cites·8 claims
- 4338US2012077348A1Substrate treatment methodSHIKI YOSHIMICHI·Filed 2011·Application pending·0 cites
- 4438US2003034048A1Back-surface cleaning method for cleaning the back surface of a silicon waferNEC CORP·Filed 2002·Application pending·0 cites
- 4527US10699968B2Semiconductor manufacturing apparatusTAKEYA YUKARI·Filed 2012·Granted Jun 30, 2020·0 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when Yoshiya Hagimoto files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →