Inventor · disambiguated record
Orlando Escorcia
Also filed as: ESCORCIA ORLANDO
13 granted patents·13 pending applications·1,962 citations·filing 2001–2013
94Inventor score
Files withAXCELIS TECH INC12LAM RES CORP4WALDFRIED CARLO2AXCELIS TECHNOLOGIES1AXCELIS TECHNOLOGY INC1
Top patents by PatentIndex Score
26 records- 0198US6756085B2Ultraviolet curing processes for advanced low-k materialsAXCELIS TECH INC·Filed 2003·Granted Jun 29, 2004·685 cites·58 claims
- 0295US6913796B2Plasma curing process for porous low-k materialsDOW CORNING·Filed 2001·Granted Jul 5, 2005·527 cites·34 claims
- 0395US6759098B2Plasma curing of MSQ-based porous low-k film materialsAXCELIS TECH INC·Filed 2001·Granted Jul 6, 2004·580 cites·19 claims
- 0494US7629272B2Ultraviolet assisted porogen removal and/or curing processes for forming porous low k dielectricsAXCELIS TECH INC·Filed 2005·Granted Dec 8, 2009·26 cites·16 claims
- 0589US6630406B2Plasma ashing processAXCELIS TECHNOLOGIES·Filed 2001·Granted Oct 7, 2003·50 cites·45 claims
- 0686US7709814B2Apparatus and process for treating dielectric materialsAXCELIS TECH INC·Filed 2005·Granted May 4, 2010·12 cites·47 claims
- 0785US6951823B2Plasma ashing processAXCELIS TECH INC·Filed 2003·Granted Oct 4, 2005·35 cites·40 claims
- 0879US6834656B2Plasma process for removing polymer and residues from substratesAXCELIS TECHNOLOGY INC·Filed 2001·Granted Dec 28, 2004·30 cites·21 claims
- 0974US7704872B2Ultraviolet assisted pore sealing of porous low k dielectric filmsAXCELIS TECH INC·Filed 2007·Granted Apr 27, 2010·1 cites·9 claims
- 1068US7678682B2Ultraviolet assisted pore sealing of porous low k dielectric filmsAXCELIS TECH INC·Filed 2004·Granted Mar 16, 2010·7 cites·20 claims
- 1158US7011868B2Fluorine-free plasma curing process for porous low-k materialsAXCELIS TECH INC·Filed 2003·Granted Mar 14, 2006·6 cites·21 claims
- 1253US2014076353A1Plasma mediated ashing processesLAM RES CORP·Filed 2013·Application pending·0 cites
- 1352US7078161B2Plasma ashing process for removing photoresist and residues during ferroelectric device fabricationINTEL CORP·Filed 2003·Granted Jul 18, 2006·3 cites·22 claims
- 1451US2009277871A1Plasma mediated ashing processes that include formation of a protective layer before and/or during the plasma mediated ashing processAXCELIS TECH INC·Filed 2009·Application pending·0 cites
- 1549US9128382B2Plasma mediated ashing processes that include formation of a protective layer before and/or during the plasma mediated ashing processLAM RES CORP·Filed 2013·Granted Sep 8, 2015·0 cites·21 claims
- 1648US2010130017A1Front end of line plasma mediated ashing processes and apparatusAXCELIS TECH INC·Filed 2008·Application pending·0 cites
- 1748US2011226280A1Plasma mediated ashing processesAXCELIS TECH INC·Filed 2011·Application pending·0 cites
- 1843US2015136171A1Liquid or vapor injection plasma ashing systems and methodsLAM RES CORP·Filed 2013·Application pending·0 cites
- 1942US2006274405A1Ultraviolet curing process for low k dielectric filmsWALDFRIED CARLO·Filed 2006·Application pending·0 cites
- 2041US2005272220A1Ultraviolet curing process for spin-on dielectric materials used in pre-metal and/or shallow trench isolation applicationsWALDFRIED CARLO·Filed 2005·Application pending·0 cites
- 2139US2014263179A1Tuning system and method for plasma-based substrate processing systemsLAM RES CORP·Filed 2013·Application pending·0 cites
- 2238US2004099283A1Drying process for low-k dielectric filmsAXCELIS TECH INC·Filed 2002·Application pending·0 cites
- 2337US2003157267A1Fluorine-free plasma curing process for porous low-k materialsFiled 2003·Application pending·0 cites
- 2435US2004058090A1Low temperature UV pretreating of porous low-k materialsFiled 2003·Application pending·0 cites
- 2534US2012024314A1Plasma mediated ashing processesLUO SHIJIAN·Filed 2010·Application pending·0 cites
- 2632US2003054115A1Ultraviolet curing process for porous low-K materialsFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →