Inventor · disambiguated record
Hiroyuki Senzai
Also filed as: SENZAI HIROYUKI
6 granted patents·4 pending applications·5 citations·filing 2012–2015
71Inventor score
Top patents by PatentIndex Score
10 records- 0170US9085685B2Under-fill material and method for producing semiconductor deviceNITTO DENKO CORP·Filed 2012·Granted Jul 21, 2015·2 cites·8 claims
- 0266US9202795B2Laminated film and use thereofODA TAKASHI·Filed 2012·Granted Dec 1, 2015·2 cites·3 claims
- 0361US9472439B2Reinforcing sheet and method for producing secondary mounted semiconductor deviceNITTO DENKO CORP·Filed 2014·Granted Oct 18, 2016·1 cites·7 claims
- 0449US9368421B2Under-fill material and method for producing semiconductor deviceNITTO DENKO CORP·Filed 2015·Granted Jun 14, 2016·0 cites·8 claims
- 0547US2015104649A1Laminated Sheet and Method of Manufacturing Semiconductor Device Using the Laminated SheetNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 0644US8951843B2Laminated sheet and method of manufacturing semiconductor device using the laminated sheetNITTO DENKO CORP·Filed 2012·Granted Feb 10, 2015·0 cites·3 claims
- 0743US8420510B2Method of manufacturing semiconductor deviceODA TAKASHI·Filed 2012·Granted Apr 16, 2013·0 cites·4 claims
- 0840US2013137219A1Method for producing semiconductor deviceNITTO DENKO CORP·Filed 2012·Application pending·0 cites
- 0939US2013157415A1Method for producing semiconductor deviceNITTO DENKO CORP·Filed 2012·Application pending·0 cites
- 1038US2012205820A1Encapsulating resin sheet and semiconductor device using the same, and manufacturing method for the semiconductor deviceODA TAKASHI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →