Laminated Sheet and Method of Manufacturing Semiconductor Device Using the Laminated Sheet

Abstract

The present invention provides a laminated sheet that can prevent the decrease in adhering strength of a resin composition layer and the deterioration in electrical reliability and in which a back grinding tape can be peeled from a plurality of semiconductor elements collectively after dicing. The laminated sheet has a back grinding tape in which a pressure-sensitive adhesive layer is formed on a base, and a resin composition layer that is provided on the pressure-sensitive adhesive layer of the back grinding tape, wherein the tensile modulus of the pressure-sensitive adhesive layer at 23° C. is 0.1 to 5.0 MPa, and the T-peeling strength between the pressure-sensitive adhesive layer and the resin composition layer is 0.1 to 5 N/20 mm at 23° C. and 300 mm/min.

What is claimed is: 
     
         1 . A laminated sheet having a back grinding tape in which a pressure-sensitive adhesive layer is formed on a base, and a resin composition layer that is provided on the pressure-sensitive adhesive layer of the back grinding tape, wherein
 a tensile modulus of the pressure-sensitive adhesive layer at 23° C. is 0.1 to 5.0 MPa, and   a T-peeling strength between the pressure-sensitive adhesive layer and the resin composition layer is 0.1 to 5 N/20 mm at 23° C. and 300 mm/min.   
     
     
         2 . The laminated sheet according to  claim 1 , wherein the resin composition layer contains a thermosetting resin. 
     
     
         3 . The laminated sheet according to  claim 1 , wherein the thermosetting resin is an epoxy resin.