Inventor · disambiguated record
Harry Michael Siegel
Also filed as: SIEGEL HARRY · SIEGEL HARRY M · SIEGEL HARRY MICHAEL
35 granted patents·5 pending applications·689 citations·filing 1993–2020
98Inventor score
Files withST MICROELECTRONICS INC23SGS THOMSON MICROELECTRONICS6SGS THOMSON MICROELECTRONICS INC6STMICROELETRONICS INC1THOMAS DANIELLE A1
Top patents by PatentIndex Score
40 records- 0195USD359028SSocketed integrated circuit packageSGS THOMSON MICROELECTRONICS INC·Filed 1993·Granted Jun 6, 1995·57 cites·1 claims
- 0292USD358806SSocketed integrated circuit packageSGS THOMSON MICROELECTRONICS INC·Filed 1993·Granted May 30, 1995·41 cites·1 claims
- 0386US7109574B2Integrated circuit package with exposed die surfaces and auxiliary attachmentST MICROELECTRONICS INC·Filed 2003·Granted Sep 19, 2006·43 cites·30 claims
- 0484US5557504ASurface mountable integrated circuit package with detachable moduleSGS THOMSON MICROELECTRONICS·Filed 1995·Granted Sep 17, 1996·76 cites·20 claims
- 0583US6771500B1System and method for direct convective cooling of an exposed integrated circuit die surfaceST MICROELECTRONICS INC·Filed 2003·Granted Aug 3, 2004·34 cites·34 claims
- 0677US6785137B2Method and system for removing heat from an active area of an integrated circuit deviceST MICROELECTRONICS INC·Filed 2002·Granted Aug 31, 2004·23 cites·20 claims
- 0776US7595017B2Method for using a pre-formed film in a transfer molding process for an integrated circuitST MICROELECTRONICS INC·Filed 2002·Granted Sep 29, 2009·21 cites·21 claims
- 0876US6693441B2Capacitive fingerprint sensor with protective coating containing a conductive suspensionST MICROELECTRONICS INC·Filed 2001·Granted Feb 17, 2004·36 cites·30 claims
- 0976US5642265ABall grid array package with detachable moduleSGS THOMSON MICROELECTRONICS·Filed 1994·Granted Jun 24, 1997·44 cites·14 claims
- 1074US7098065B2Integrated lid formed on MEMS deviceST MICROELECTRONICS INC·Filed 2004·Granted Aug 29, 2006·18 cites·24 claims
- 1174US6769174B2Leadframeless package structure and methodSTMICROELETRONICS INC·Filed 2002·Granted Aug 3, 2004·16 cites·20 claims
- 1272US5570273ASurface mountable integrated circuit package with low-profile detachable moduleSGS THOMSON MICROELECTRONICS·Filed 1994·Granted Oct 29, 1996·47 cites·16 claims
- 1370US7786582B2System for providing a redistribution metal layer in an integrated circuitST MICROELECTRONICS INC·Filed 2006·Granted Aug 31, 2010·4 cites·12 claims
- 1469US6700190B2Integrated circuit device with exposed upper and lower die surfacesST MICROELECTRONICS INC·Filed 2002·Granted Mar 2, 2004·15 cites·27 claims
- 1567US6762470B2Fingerprint sensor having a portion of the fluorocarbon polymer physical interface layer amorphizedST MICROELECTRONICS INC·Filed 2001·Granted Jul 13, 2004·21 cites·9 claims
- 1667US5994774ASurface mountable integrated circuit package with detachable module and interposerST MICROELECTRONICS INC·Filed 1997·Granted Nov 30, 1999·33 cites·20 claims
- 1767US5724728AMethod of mounting an integrated circuit to a mounting surfaceSGS THOMSON MICROELECTRONICS·Filed 1995·Granted Mar 10, 1998·29 cites·6 claims
- 1864US6372543B1Wrap-around interconnect for fine pitch ball grid arrayST MICROELECTRONICS INC·Filed 2000·Granted Apr 16, 2002·10 cites·20 claims
- 1961US7096581B2Method for providing a redistribution metal layer in an integrated circuitST MICROELECTRONICS INC·Filed 2002·Granted Aug 29, 2006·7 cites·11 claims
- 2060US8163645B2Method for providing a redistribution metal layer in an integrated circuitTHOMAS DANIELLE A·Filed 2010·Granted Apr 24, 2012·1 cites·20 claims
- 2160US5451715AMolded package integrated circuit with electrochemical cellSGS THOMSON MICROELECTRONICS·Filed 1993·Granted Sep 19, 1995·27 cites·18 claims
- 2256US6707093B2Selective ionic implantation of fluoropolymer film to modify the sensitivity of underlying sensing capacitorsST MICROELECTRONICS INC·Filed 2001·Granted Mar 16, 2004·6 cites·6 claims
- 2356US2021146969A1Electrically and thermally conductive thermoplastic polyurethaneUNIV TEXAS·Filed 2020·Application pending·0 cites
- 2453US6603192B2Scratch resistance improvement by filling metal gapsST MICROELECTRONICS INC·Filed 1999·Granted Aug 5, 2003·17 cites·26 claims
- 2552US6759326B2Method of making a semiconductor device having a planarized fluoropolymer passivating layer with selectively implanted charged particlesST MICROELECTRONICS INC·Filed 2003·Granted Jul 6, 2004·4 cites·4 claims
- 2652US6121678AWrap-around interconnect for fine pitch ball grid arrayST MICROELECTRONICS INC·Filed 1997·Granted Sep 19, 2000·15 cites·19 claims
- 2752US5610800ASubstrate mounting of circuit components with a low profileSGS THOMSON MICROELECTRONICS·Filed 1995·Granted Mar 11, 1997·18 cites·18 claims
- 2852USD358805SDetachable integrated circuit moduleSGS THOMSON MICROELECTRONICS INC·Filed 1993·Granted May 30, 1995·7 cites·1 claims
- 2950US7456050B2System and method for controlling integrated circuit die height and planarityST MICROELECTRONICS INC·Filed 2003·Granted Nov 25, 2008·4 cites·6 claims
- 3049US2006261450A1Leadframeless package structure and methodST MICROELECTRONICS INC·Filed 2006·Application pending·0 cites
- 3148US6900508B2Embedded flat film moldingST MICROELECTRONICS INC·Filed 2002·Granted May 31, 2005·3 cites·20 claims
- 3247US6600227B1System and method for providing mechanical planarization of a sequential build up substrate for an integrated circuit packageST MICROELECTRONICS INC·Filed 2002·Granted Jul 29, 2003·2 cites·21 claims
- 3346USD358804SDetachable integrated circuit moduleSGS THOMSON MICROELECTRONICS INC·Filed 1993·Granted May 30, 1995·5 cites·1 claims
- 3444US7202110B2Embedded flat film moldingST MICROELECTRONICS INC·Filed 2004·Granted Apr 10, 2007·1 cites·13 claims
- 3542US2004200062A1Leadframeless package structure and methodST MICROELECTRONICS INC·Filed 2004·Application pending·0 cites
- 3641US2003199147A1Use of fluoropolymer coating for planarizing and passivating integrated circuit devicesFiled 2003·Application pending·0 cites
- 3739US6951125B2System and method for aligning an integrated circuit die on an integrated circuit substrateST MICROELECTRONICS INC·Filed 2002·Granted Oct 4, 2005·0 cites·23 claims
- 3839US2003104693A1Use of fluoropolymer coating for planarizing and passivating integrated circuit devicesFiled 2001·Application pending·0 cites
- 3938USD354275SLow-profile detachable integrated circuit moduleSGS THOMSON MICROELECTRONICS INC·Filed 1994·Granted Jan 10, 1995·3 cites·1 claims
- 4032USD354274SLow-profile detachable integrated circuit moduleSGS THOMSON MICROELECTRONICS INC·Filed 1994·Granted Jan 10, 1995·1 cites·1 claims
Join the waitlist — get patent alerts
Get an alert when Harry Michael Siegel files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →