Leadframeless package structure and method

Abstract

A method for providing a leadframeless package structure is provided. The method includes providing a temporary carrier. The temporary carrier is coupled to a metal foil layer with a temporary adhesive layer. An integrated circuit chip is coupled to the metal foil layer. The temporary adhesive layer and the temporary carrier are removed to form the leadframeless package structure after molding.

1 - 14 . (canceled)  
   
   
       15 . A leadframeless package structure, comprising: 
 a temporary carrier:    a metal foil layer;    a temporary adhesive coupling the temporary carrier and the metal foil layer;    an integrated circuit chip coupled to the metal foil layer;    a plurality of bonding wires, each bonding wire coupling a specified area of the chip to the metal foil layer; and    a molding compound formed outwardly of the metal foil layer, the bonding wires and the chip;    wherein the temporary adhesive when thermally softened allows the temporary carrier to be uncoupled from the metal foil layer, the temporary adhesive when thermally softened having an adhesion to the temporary carrier that is greater than an adhesion to at least one of: the metal foil layer and the molding compound.    
   
   
       16 . (canceled)  
   
   
       17 . The leadframeless package structure of  claim 15 , the temporary carrier comprising at least one of aluminum, stainless steel, and laminate epoxy fiberglass, and the temporary adhesive layer comprising silicone.  
   
   
       18 . The leadframeless package structure of  claim 15 , further comprising a permanent adhesive coupling the chip to the metal foil layer.  
   
   
       19 . The leadframeless package structure of  claim 15 , the metal foil layer comprising at least one of copper and gold-plated copper.  
   
   
       20 . A leadframeless package structure comprising a multi-chip module, the multi-chip module comprising: 
 at least one temporary carrier:    at least one metal foil layer;    a temporary adhesive coupling the at least one temporary carrier and the at least one metal foil layer:    a plurality of integrated circuit chips:    a permanent adhesive coupling the integrated circuit chips to the at least one metal foil layer;    a plurality of bonding wires, each bonding wire coupling a specified area of one of the chips to one of the metal foil layers; and    a molding compound formed outwardly of the metal foil layers, the bonding wires and the chips;    wherein the temporary adhesive when thermally softened allows the at least one temporary carrier to be uncoupled from the at least one metal foil layer, the temporary adhesive when thermally softened having an adhesion to the at least one temporary carrier that is greater than an adhesion to at least one of: the at least one metal foil layer and the molding compound.    
   
   
       21 . The leadframeless package structure of  claim 18 , wherein the permanent adhesive comprises an epoxy resin.  
   
   
       22 . The leadframeless package structure of  claim 15 , wherein the temporary carrier comprises a rigid temporary carrier.  
   
   
       23 . The leadframeless package structure of  claim 15 , wherein the metal foil layer is patterned and etched to form circuit patterns.  
   
   
       24 . The leadframeless package structure of  claim 15 , wherein the plurality of bonding wires couple bond pads on the chip to the metal foil layer.  
   
   
       25 . The leadframeless package structure of  claim 15 , wherein the molding compound is selectively formed over and around portions of the chip to expose a surface of the chip.  
   
   
       26 . The leadframeless package structure of  claim 20 , wherein the at least one temporary carrier comprises at least one rigid temporary carrier.  
   
   
       27 . The leadframeless package structure of  claim 20 , wherein the at least one temporary carrier comprises at least one of aluminum, stainless steel, and laminate epoxy fiberglass, and the temporary adhesive layer comprises silicone.  
   
   
       28 . The leadframeless package structure of  claim 20 , wherein the at least one metal foil layer comprises at least one of copper and gold-plated copper.  
   
   
       29 . The leadframeless package structure of  claim 20 , wherein the permanent adhesive comprises an epoxy resin.  
   
   
       30 . The leadframeless package structure of  claim 20 , wherein the at least one metal foil layer is patterned and etched to form circuit patterns.  
   
   
       31 . The leadframeless package structure of  claim 20 , wherein the plurality of bonding wires couple bond pads on the chips to the at least one metal foil layer.  
   
   
       32 . The leadframeless package structure of  claim 20 , wherein the molding compound is selectively formed over and around portions of at least one of the chips to expose a surface of at least one of the chips.  
   
   
       33 . A leadframeless package structure, comprising: 
 a rigid temporary carrier;    a metal foil layer coupled to the rigid temporary carrier by a temporary adhesive;    an integrated circuit chip coupled to the metal foil layer;    a plurality of bonding wires each coupling the chip to the metal foil layer; and    a molding compound formed outwardly of the metal foil layer, the bonding wires and the chip;    wherein the temporary adhesive is capable of allowing the rigid temporary carrier to be uncoupled from the metal foil layer, the temporary adhesive further capable of adhering more to the rigid temporary carrier than to the metal foil layer and the molding compound when the rigid temporary carrier is uncoupled from the metal foil layer.    
   
   
       34 . The leadframeless package structure of  claim 33 , wherein the temporary adhesive when thermally softened has an adhesion to the temporary carrier that is greater than an adhesion to at least one of: the metal foil layer and the molding compound.  
   
   
       35 . The leadframeless package structure of  claim 33 , wherein the molding compound is selectively formed over and around portions of the chip to expose a surface of the chip.