Leadframeless package structure and method

Abstract

A method for providing a leadframeless package structure is provided. The method includes providing a temporary carrier. The temporary carrier is coupled to a metal foil layer with a temporary adhesive layer. An integrated circuit chip is coupled to the metal foil layer. The temporary adhesive layer and the temporary carrier are removed to form the leadframeless package structure after molding.

What is claimed is:  
     
         1 . A method for providing a leadframeless package structure, comprising: 
 providing a temporary carrier;    coupling the temporary carrier to a metal foil layer with a temporary adhesive layer;    coupling an integrated circuit chip to the metal foil layer; and    removing the temporary adhesive layer and the temporary carrier to form the leadframeless package structure after molding.    
     
     
         2 . The method of  claim 1 , the temporary carrier comprising one of aluminum, stainless steel, and laminate epoxy fiberglass.  
     
     
         3 . The method of  claim 1 , the temporary adhesive layer comprising silicone.  
     
     
         4 . The method of  claim 1 , the metal foil layer comprising one of gold-plated copper and non-gold-plated copper.  
     
     
         5 . The method of  claim 1 , coupling an integrated circuit chip to the metal foil layer comprising coupling the chip to the metal foil layer with a permanent adhesive.  
     
     
         6 . The method of  claim 5 , the permanent adhesive comprising an epoxy resin.  
     
     
         7 . The method of  claim 1 , further comprising patterning and etching the metal foil layer to form circuit patterns.  
     
     
         8 . The method of  claim 7 , further comprising: 
 coupling each of a plurality of bond pads on the chip to the patterned metal foil layer with one of a plurality of bonding wires; and    forming a molding compound over the metal foil layer, the bonding wires and the chip.    
     
     
         9 . The method of  claim 8 , forming a molding compound comprising forming the molding compound selectively over and around portions of the chip to expose a surface of the chip.  
     
     
         10 . A method for providing a leadframeless package structure, comprising: 
 providing a temporary carrier;    forming a temporary adhesive layer adjacent to the temporary carrier;    forming a metal foil layer outwardly of the temporary adhesive layer;    patterning and etching the metal foil layer to form circuit patterns;    coupling an integrated circuit chip to the metal foil layer;    coupling each of a plurality of bond pads on the chip to the patterned metal foil layer with one of a plurality of bonding wires;    forming a molding compound outwardly of the metal foil layer, the bonding wires and the chip; and    removing the temporary adhesive layer and the temporary carrier to form the leadframeless package structure.    
     
     
         11 . The method of  claim 10 , the temporary carrier comprising one of aluminum, stainless steel, and laminate epoxy fiberglass.  
     
     
         12 . The method of  claim 10 , the temporary adhesive layer comprising silicone.  
     
     
         13 . The method of  claim 10 , the metal foil layer comprising one of copper and gold-plated copper.  
     
     
         14 . The method of  claim 10 , forming a molding compound comprising forming the molding compound selectively over and around portions of the chip to expose a surface of the chip.  
     
     
         15 . A leadframeless package structure, comprising: 
 a metal foil layer uncoupled from a temporary carrier;    an integrated circuit chip coupled to the metal foil layer;    a plurality of bonding wires, each bonding wire coupling a specified area of the chip to the metal foil layer; and    a molding compound formed outwardly of the metal foil layer, the bonding wires and the chip.    
     
     
         16 . The leadframeless package structure of  claim 15 , the metal foil layer uncoupled from the temporary carrier by removing a temporary adhesive layer coupled between the temporary carrier and the metal foil layer.  
     
     
         17 . The leadframeless package structure of  claim 16 , the temporary carrier comprising one of aluminum, stainless steel, and laminate epoxy fiberglass and the temporary adhesive layer comprising silicone.  
     
     
         18 . The leadframeless package structure of  claim 15 , further comprising a permanent adhesive coupling the chip to the metal foil layer.  
     
     
         19 . The leadframeless package structure of  claim 15 , the metal foil layer comprising one of copper and gold-plated copper.  
     
     
         20 . A leadframeless package structure comprising a multi-chip module, the multi-chip module comprising: 
 for each of a plurality of integrated circuit chips, a metal foil layer uncoupled from a temporary carrier by removing a temporary adhesive layer coupled between the temporary carrier and the metal foil layer,    a permanent adhesive coupling the integrated circuit chip to the metal foil layer, and    a plurality of bonding wires, each bonding wire coupling a specified area of the chip to the metal foil layer; and    a molding compound formed outwardly of the metal foil layers, the bonding wires and the chips.