Inventor · disambiguated record
Paul J. Brown
Also filed as: BROWN PAUL · BROWN PAUL J · BROWN PAUL JAMES
38 granted patents·15 pending applications·654 citations·filing 1979–2024
98Inventor score
Top patents by PatentIndex Score
53 records- 0191US5107489ASwitch and its protocol for making dynamic connectionsBROWN PAUL J·Filed 1989·Granted Apr 21, 1992·142 cites·25 claims
- 0290US6908314B2Tailored interconnect moduleCIT ALCATEL·Filed 2003·Granted Jun 21, 2005·72 cites·3 claims
- 0387US9635760B10204 shifted vias with merge padsALCATEL-LUCENT CANADA INC·Filed 2016·Granted Apr 25, 2017·5 cites·6 claims
- 0487US8806420B2In-grid on-device decoupling for BGACHAN ALEX·Filed 2011·Granted Aug 12, 2014·9 cites·17 claims
- 0587US7602615B2In-grid decoupling for ball grid array (BGA) devicesALCATEL LUCENT·Filed 2007·Granted Oct 13, 2009·15 cites·7 claims
- 0686US8759689B2Land pattern for 0201 components on a 0.8 mm pitch arrayCHAN ALEX·Filed 2011·Granted Jun 24, 2014·8 cites·10 claims
- 0782US7697558B2Emergency alert system enhancement using alert server and metro ATM network for DSL deploymentALCATEL LUCENT·Filed 2007·Granted Apr 13, 2010·16 cites·19 claims
- 0880US9769925B2Relieved component pad for 0201 use between viasALCATEL-LUCENT CANADA INC·Filed 2015·Granted Sep 19, 2017·3 cites·7 claims
- 0980US7365435B2Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect gridCIT ALCATEL·Filed 2005·Granted Apr 29, 2008·8 cites·1 claims
- 1078US9832899B1Side clamping BGA socketALCATEL-LUCENT CANADA INC·Filed 2016·Granted Nov 28, 2017·2 cites·20 claims
- 1178US9560742B2Backdrill reliability anchorsALCATEL-LUCENT CANADA INC·Filed 2014·Granted Jan 31, 2017·3 cites·19 claims
- 1277US8912449B2Thermal warp compensation IC packageBROWN PAUL JAMES·Filed 2012·Granted Dec 16, 2014·4 cites·10 claims
- 1377US7343577B2Area array routing masks for improved escape of devices on PCBCIT ALCATEL·Filed 2005·Granted Mar 11, 2008·7 cites·24 claims
- 1475US8559180B2Removable IC package stiffening brace and methodBROWN PAUL J·Filed 2010·Granted Oct 15, 2013·4 cites·18 claims
- 1574US7845618B2Valve door with ball couplingAPPLIED MATERIALS INC·Filed 2007·Granted Dec 7, 2010·7 cites·13 claims
- 1674US7368667B2Using rows/columns of micro-vias to create PCB routing channels in BGA interconnect grid (micro-via channels)CIT ALCATEL·Filed 2005·Granted May 6, 2008·6 cites·5 claims
- 1774US4400773AIndependent handling of I/O interrupt requests and associated status information transfersIBM·Filed 1980·Granted Aug 23, 1983·44 cites·8 claims
- 1871US7269813B2Off-width pitch for improved circuit card routingCIT ALCATEL·Filed 2004·Granted Sep 11, 2007·18 cites·6 claims
- 1969US8863071B2De-pop on-device decoupling for BGACHAN ALEX·Filed 2011·Granted Oct 14, 2014·2 cites·14 claims
- 2066US5455831AFrame group transmission and reception for parallel/serial busesIBM·Filed 1993·Granted Oct 3, 1995·50 cites·23 claims
- 2166US5423006ANotification and verification of state changes in a data processing input/output systemIBM·Filed 1993·Granted Jun 6, 1995·46 cites·23 claims
- 2266US5371897AMethod for requesting identification of a neighbor node in a data processing I/O systemIBM·Filed 1991·Granted Dec 6, 1994·51 cites·9 claims
- 2364US8389864B2Warp reactive IC packageBROWN PAUL JAMES·Filed 2010·Granted Mar 5, 2013·2 cites·8 claims
- 2461US4342082AProgram instruction mechanism for shortened recursive handling of interruptionsIBM·Filed 1979·Granted Jul 27, 1982·24 cites·3 claims
- 2559US12250770B2Board edge electrical contact structuresNOKIA SOLUTIONS & NETWORKS OY·Filed 2021·Granted Mar 11, 2025·0 cites·18 claims
- 2659US10257952B2Side clamping BGA socketALCATEL LUCENT CANADA INC·Filed 2017·Granted Apr 9, 2019·0 cites·19 claims
- 2759US5412803ACommunications system having plurality of originator and corresponding recipient buffers with each buffer having three different logical areas for transmitting messages in single transferIBM·Filed 1992·Granted May 2, 1995·35 cites·22 claims
- 2858US10743408B2Array type discrete decoupling under BGA gridALCATEL-LUCENT CANADA INC·Filed 2018·Granted Aug 11, 2020·0 cites·11 claims
- 2958US2025254788A1In-line capacitor moduleNOKIA SOLUTIONS & NETWORKS OY·Filed 2024·Application pending·0 cites
- 3056US7738259B2Shared via decoupling for area arrays componentsALCATEL LUCENT·Filed 2004·Granted Jun 15, 2010·9 cites·12 claims
- 3156US7663888B2Printed circuit board thickness adaptorsALCATEL LUCENT·Filed 2006·Granted Feb 16, 2010·1 cites·16 claims
- 3256US2025031318A1Plated via-in-via vertical connectionNOKIA SOLUTIONS & NETWORKS OY·Filed 2023·Application pending·0 cites
- 3356US2024347432A1Configurable warpage control spacersNOKIA SOLUTIONS & NETWORKS OY·Filed 2023·Application pending·0 cites
- 3455US2024381603A1Pre-assembly warpage pairingNOKIA SOLUTIONS & NETWORKS OY·Filed 2023·Application pending·0 cites
- 3554US10667399B1Discrete component carrierNOKIA SOLUTIONS & NETWORKS OY·Filed 2018·Granted May 26, 2020·0 cites·15 claims
- 3654US5267240AFrame-group transmission and reception for parallel/serial busesIBM·Filed 1992·Granted Nov 30, 1993·19 cites·23 claims
- 3753US7714234B2Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect gridALCATEL LUCENT·Filed 2008·Granted May 11, 2010·0 cites·5 claims
- 3853US2015001716A1De-pop on-device decoupling for bgaALCATEL LUCENT CANADA INC·Filed 2014·Application pending·0 cites
- 3952US10650181B2Spatial location of vias in a printed circuit boardNOKIA SOLUTIONS & NETWORKS OY·Filed 2017·Granted May 12, 2020·0 cites·13 claims
- 4051US2017367180A1Array type discrete decoupling under bga gridALCATEL-LUCENT CANADA INC·Filed 2016·Application pending·0 cites
- 4149US2015092373A1Mounting solution for components on a very fine pitch arrayALCATEL LUCENT CANADA INC·Filed 2013·Application pending·0 cites
- 4248US2023132123A1Solder trenchNOKIA TECHNOLOGIES OY·Filed 2021·Application pending·0 cites
- 4345US5294129AThrow toy with two spongy weights and energy storing stretchy webBROWN PAUL J·Filed 1992·Granted Mar 15, 1994·17 cites·14 claims
- 4443US9951898B2Anti-tangling coupling deviceBOOHER SR BENJAMIN V·Filed 2015·Granted Apr 24, 2018·0 cites·8 claims
- 4543US2012081872A1Thermal warp compensation ic packageBROWN PAUL JAMES·Filed 2010·Application pending·0 cites
- 4642US5450073AControlling power sequencing of a control unit in an input/output systemIBM·Filed 1994·Granted Sep 12, 1995·14 cites·11 claims
- 4740US5206860ARecovery from a possible switching error in a computer i/o systemIBM·Filed 1990·Granted Apr 27, 1993·11 cites·11 claims
- 4840US2018165401A1Non-orthogonal routing on a printed circuit boardALCATEL LUCENT CANADA INC·Filed 2016·Application pending·0 cites
- 4938US2018082868A1Gravity force compensation plate for upside down ball grid arrayALCATEL LUCENT CANADA INC·Filed 2017·Application pending·0 cites
- 5038US2018020547A1Underlying recessed component placementCHAN ALEX L·Filed 2016·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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