Inventor · disambiguated record
Garrett H. Sin
Also filed as: SIN GARRETT · SIN GARRETT H · SIN GARRETT HO-YEE
17 granted patents·9 pending applications·91 citations·filing 2004–2025
92Inventor score
Top patents by PatentIndex Score
26 records- 0194US10493590B2Selection of polishing parameters to generate removal or pressure profileAPPLIED MATERIALS INC·Filed 2015·Granted Dec 3, 2019·8 cites·22 claims
- 0291US8372210B2Post CMP scrubbing of substratesAPPLIED MATERIALS INC·Filed 2008·Granted Feb 12, 2013·15 cites·11 claims
- 0390US11853042B2Part, sensor, and metrology data integrationAPPLIED MATERIALS INC·Filed 2021·Granted Dec 26, 2023·2 cites·17 claims
- 0490US9213340B2Selection of polishing parameters to generate removal or pressure profileAPPLIED MATERIALS INC·Filed 2014·Granted Dec 15, 2015·11 cites·21 claims
- 0588US8202738B2Endpoint method using peak location of modified spectraDAVID JEFFREY DRUE·Filed 2011·Granted Jun 19, 2012·9 cites·20 claims
- 0687US8774958B2Selection of polishing parameters to generate removal profileZHANG HUANBO·Filed 2011·Granted Jul 8, 2014·15 cites·21 claims
- 0785US7980000B2Vapor dryer having hydrophilic end effectorAPPLIED MATERIALS INC·Filed 2008·Granted Jul 19, 2011·13 cites·20 claims
- 0884US8205352B2Vapor dryer having hydrophilic end effectorLEWIS JOHN S·Filed 2011·Granted Jun 26, 2012·8 cites·20 claims
- 0983US11592812B2Sensor metrology data integrationAPPLIED MATERIALS INC·Filed 2020·Granted Feb 28, 2023·2 cites·20 claims
- 1079US2025271847A1Data intergrationAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1178US8628376B2In-line wafer thickness sensingSIN GARRETT H·Filed 2009·Granted Jan 14, 2014·8 cites·11 claims
- 1275US2024061409A1Part, sensor, and metrology data integrationAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1374US12366853B2Sensor metrology data integrationAPPLIED MATERIALS INC·Filed 2023·Granted Jul 22, 2025·0 cites·20 claims
- 1464US11241769B2Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processesAPPLIED MATERIALS INC·Filed 2018·Granted Feb 8, 2022·0 cites·15 claims
- 1559US2025279274A1Vapor dryer with integrated particle monitoringAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1658US10252397B2Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processesAPPLIED MATERIALS INC·Filed 2015·Granted Apr 9, 2019·0 cites·9 claims
- 1758US2023023915A1Interlocked stepped retaining ringAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 1855US10434623B2Local area polishing system and polishing pad assemblies for a polishing systemAPPLIED MATERIALS INC·Filed 2017·Granted Oct 8, 2019·0 cites·19 claims
- 1952US2013139851A1Post cmp scrubbing of substratesAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 2047US2006088999A1Methods and compositions for chemical mechanical polishing substratesAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 2146US11157661B2Process development visualization toolAPPLIED MATERIALS INC·Filed 2019·Granted Oct 26, 2021·0 cites·20 claims
- 2246US2008138988A1Detection of clearance of polysilicon residueDAVID JEFFREY DRUE·Filed 2007·Application pending·0 cites
- 2343US2006088976A1Methods and compositions for chemical mechanical polishing substratesAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 2443US2005109371A1Post CMP scrubbing of substratesAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 2540US9873179B2Carrier for small pad for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2016·Granted Jan 23, 2018·0 cites·21 claims
- 2638US10610994B2Polishing system with local area rate control and oscillation modeAPPLIED MATERIALS INC·Filed 2017·Granted Apr 7, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →