Inventor · disambiguated record
Dong Gi An
Also filed as: AN DONG G · AN DONG GI
9 granted patents·9 pending applications·77 citations·filing 2003–2020
88Inventor score
Top patents by PatentIndex Score
18 records- 0192US9743529B2Multilayer rigid flexible printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 22, 2017·9 cites·18 claims
- 0292US8558116B2Multilayer rigid flexible printed circuit board and method for manufacturing the sameLEE YANG JE·Filed 2010·Granted Oct 15, 2013·13 cites·7 claims
- 0391US8631567B2Method of manufacturing rigid-flexible printed circuit boardLEE YANG JE·Filed 2010·Granted Jan 21, 2014·20 cites·5 claims
- 0485US9338899B2Method of manufacturing a rigid-flexible printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Granted May 10, 2016·8 cites·11 claims
- 0585US7281328B2Method of fabricating rigid-flexible printed circuit boardSAMSUNG ELECTRO MECH·Filed 2005·Granted Oct 16, 2007·20 cites·5 claims
- 0683US10368445B2Multilayer rigid flexible printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 30, 2019·2 cites·11 claims
- 0782US9674968B2Rigid flexible printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Jun 6, 2017·5 cites·17 claims
- 0871US10674610B1Multilayer rigid flexible printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2020·Granted Jun 2, 2020·0 cites·10 claims
- 0965US10602616B2Multilayer rigid flexible printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Mar 24, 2020·0 cites·11 claims
- 1055US2014021164A1Method for manufacturing a multilayer rigid flexible printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1149US2010155108A1Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1245US2008014768A1Rigid-flexible printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1344US2015189735A1Rigid flexible printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1443US2010147563A1Substrate having electromagnetic shielding memberSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1540US2007104929A1Method for plating printed circuit board and printed circuit board manufactured therefromYMT CO LTD·Filed 2006·Application pending·0 cites
- 1640US2008257742A1Method of manufacturing printed circuit board for semiconductor packageSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1737US2003194485A1Alloy plating solution for surface treatment of modular printed circuit boardFiled 2003·Application pending·0 cites
- 1830US2016037624A1Flexible printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →