Inventor · disambiguated record
Paul Ganitzer
Also filed as: GANITZER PAUL
23 granted patents·6 pending applications·40 citations·filing 2006–2022
93Inventor score
Files withINFINEON TECHNOLOGIES AG14INFINEON TECHNOLOGIES AUSTRIA AG5GANITZER PAUL3INFINEON TECHNOLOGIES AUSTRIA3OTREMBA RALF1
Top patents by PatentIndex Score
29 records- 0190US7851349B2Method for producing a connection electrode for two semiconductor zones arranged one above anotherINFINEON TECHNOLOGIES AUSTRIA·Filed 2006·Granted Dec 14, 2010·15 cites·11 claims
- 0285US9029200B2Method for manufacturing semiconductor devices having a metallisation layerZELSACHER RUDOLF·Filed 2010·Granted May 12, 2015·10 cites·9 claims
- 0383US11302579B2Composite wafer, semiconductor device and electronic componentINFINEON TECHNOLOGIES AG·Filed 2020·Granted Apr 12, 2022·1 cites·5 claims
- 0479US10672664B2Composite wafer, semiconductor device, electronic component and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 2, 2020·2 cites·14 claims
- 0575US9070741B2Method of manufacturing a semiconductor device and a semiconductor workpieceINFINEON TECHNOLOGIES AUSTRIA·Filed 2012·Granted Jun 30, 2015·2 cites·24 claims
- 0675US8710678B2Device and method including a soldering processGANITZER PAUL·Filed 2012·Granted Apr 29, 2014·4 cites·12 claims
- 0774US11848237B2Composite wafer, semiconductor device and electronic componentINFINEON TECHNOLOGIES AG·Filed 2022·Granted Dec 19, 2023·0 cites·10 claims
- 0871US9397055B2Processing of thick metal padsINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jul 19, 2016·2 cites·18 claims
- 0970US12087717B2Semiconductor package and methods of manufacturing a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Sep 10, 2024·0 cites·23 claims
- 1069US11552016B2Semiconductor device with metallization structure on opposite sides of a semiconductor portionINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 10, 2023·0 cites·23 claims
- 1169US10573533B2Method of reducing a sheet resistance in an electronic device, and an electronic deviceINFINEON TECHNOLOGIES AG·Filed 2018·Granted Feb 25, 2020·1 cites·13 claims
- 1266US8603858B2Method for manufacturing a semiconductor packageSTANDING MARTIN·Filed 2011·Granted Dec 10, 2013·2 cites·23 claims
- 1362US10971449B2Semiconductor device with metallization structure on opposite sides of a semiconductor portionINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 6, 2021·0 cites·19 claims
- 1459US11081457B2Semiconductor package and methods of manufacturing a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Aug 3, 2021·0 cites·26 claims
- 1558US10593623B2Semiconductor device with metallization structure on opposite sides of a semiconductor portionINFINEON TECHNOLOGIES AG·Filed 2017·Granted Mar 17, 2020·0 cites·16 claims
- 1657US9935055B2Methods of manufacturing a semiconductor device by forming a separation trenchINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Apr 3, 2018·0 cites·12 claims
- 1757US8324115B2Semiconductor chip, semiconductor device and methods for producing the sameOTREMBA RALF·Filed 2006·Granted Dec 4, 2012·1 cites·27 claims
- 1856US9030028B2Method for manufacturing semiconductor devices having a metallisation layerINFINEON TECHNOLOGIES AUSTRIA·Filed 2014·Granted May 12, 2015·0 cites·3 claims
- 1954US9461004B2Semiconductor workpiece having a semiconductor substrate with at least two chip areasINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted Oct 4, 2016·0 cites·9 claims
- 2053US2019259874A1Wafer based beol process for chip embeddingINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 2151US9887152B2Method for manufacturing semiconductor devices having a metallisation layerINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted Feb 6, 2018·0 cites·15 claims
- 2251US9673157B2Processing of thick metal padsINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jun 6, 2017·0 cites·26 claims
- 2348US8211752B2Device and method including a soldering processGANITZER PAUL·Filed 2007·Granted Jul 3, 2012·0 cites·18 claims
- 2448US2015221764A1Wafer based beol process for chip embeddingINFINEON TECHNOLOGIES AG·Filed 2014·Application pending·0 cites
- 2546US2011294289A1Method for Producing a Connection Electrode for Two Semiconductor Zones Arranged One Above AnotherREIGER WALTER·Filed 2010·Application pending·0 cites
- 2645US2008096382A1Method for producing an integrated circuit including a connection contact on a semiconductor bodyINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 2744US9006899B2Layer stackINFINEON TECHNOLOGIES AG·Filed 2012·Granted Apr 14, 2015·0 cites·7 claims
- 2843US2016336226A1Method of reducing a sheet resistance in an electronic device, and an electronic deviceINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
- 2938US2006273810A1Silicon wafer with solderable coating on its wafer rear side, and process for producing itGANITZER PAUL·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →