Inventor · disambiguated record
Woon-Byung Kang
Also filed as: KANG WOON · KANG WOON-BYUNG
1 granted patent·3 pending applications·3 citations·filing 2006–2022
24Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0163US7569423B2Wafer-level-chip-scale package and method of fabricationSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 4, 2009·3 cites·7 claims
- 0238US2024234364A9Semiconductor package and manufacturing method thereforLG INNOTEK CO LTD·Filed 2022·Application pending·0 cites
- 0338US2007018324A1Wafer-level-chip-scale package and method of fabricationKWON YONG-HWAN·Filed 2006·Application pending·0 cites
- 0437US2007007664A1Semiconductor package with molded back side and method of fabricating the sameLEE CHUNG-SUN·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →