Inventor · disambiguated record
Pei-Jer Tzeng
Also filed as: TZENG PEI-JER
13 granted patents·7 pending applications·571 citations·filing 2004–2023
88Inventor score
Files withIND TECH RES INST15WANG CHUNG-CHIH2LIAO SUE-CHEN1NAT UNIV TSING HUA1TAIWAN SEMICONDUCTOR MFG CO LTD1
Top patents by PatentIndex Score
20 records- 0197US7405166B2Method of manufacturing charge storage deviceIND TECH RES INST·Filed 2006·Granted Jul 29, 2008·550 cites·23 claims
- 0283US10416114B2Structures and manufacture method of electrochemical unitsIND TECH RES INST·Filed 2016·Granted Sep 17, 2019·3 cites·37 claims
- 0376US10908113B2Liquid-sensing apparatus and method of manufacturing the sameIND TECH RES INST·Filed 2018·Granted Feb 2, 2021·2 cites·15 claims
- 0473US7663177B2Non-volatile memory device and fabricating method thereofIND TECH RES INST·Filed 2005·Granted Feb 16, 2010·6 cites·10 claims
- 0562US12469553B2Operating method, memory system, and control circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·20 claims
- 0657US7507653B2Method of fabricating metal compound dots dielectric pieceIND TECH RES INST·Filed 2006·Granted Mar 24, 2009·2 cites·17 claims
- 0757US6991989B2Process of forming high-k gate dielectric layer for metal oxide semiconductor transistorIND TECH RES INST·Filed 2004·Granted Jan 31, 2006·8 cites·13 claims
- 0855US10983087B2Structures and manufacture method of electrochemical unitsIND TECH RES INST·Filed 2019·Granted Apr 20, 2021·0 cites·21 claims
- 0953US11856789B2Ferroeolectric memories with ferroelectric composite layerIND TECH RES INST·Filed 2021·Granted Dec 26, 2023·0 cites·17 claims
- 1052US9257338B2TSV substrate structure and the stacked assembly thereofIND TECH RES INST·Filed 2015·Granted Feb 9, 2016·0 cites·3 claims
- 1152US2013214390A1Tsv substrate structure and the stacked assembly thereofIND TECH RES INST·Filed 2013·Application pending·0 cites
- 1250US7781298B2Methods for fabricating a capacitorIND TECH RES INST·Filed 2008·Granted Aug 24, 2010·0 cites·18 claims
- 1347US2012133030A1Tsv substrate structure and the stacked assembly thereofWANG CHUNG-CHIH·Filed 2010·Application pending·0 cites
- 1445US7405122B2Methods for fabricating a capacitorIND TECH RES INST·Filed 2006·Granted Jul 29, 2008·0 cites·19 claims
- 1543US9721824B2Wafer bonding method and device with reduced thermal expansionIND TECH RES INST·Filed 2015·Granted Aug 1, 2017·0 cites·13 claims
- 1643US2009124483A1Metal compound dots dielectric pieceIND TECH RES INST·Filed 2009·Application pending·0 cites
- 1738US2011018049A1Charge trapping device and method for manufacturing the sameNAT UNIV TSING HUA·Filed 2009·Application pending·0 cites
- 1837US2013270713A1Dual damascene structure having through silicon via and manufacturing method thereofLIAO SUE-CHEN·Filed 2012·Application pending·0 cites
- 1937US2019186969A1Sensing device and method for manufacturing the sameIND TECH RES INST·Filed 2018·Application pending·0 cites
- 2035US2012127625A1Trench capacitor structures and method of manufacturing the sameWANG CHUNG-CHIH·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →