Inventor · disambiguated record
Peter Hey
Also filed as: HEY PETER · HEY PETER W
10 granted patents·5 pending applications·1,220 citations·filing 1995–2006
93Inventor score
Files withAPPLIED MATERIALS INC15
Top patents by PatentIndex Score
15 records- 0198US6258220B1Electro-chemical deposition systemAPPLIED MATERIALS INC·Filed 1999·Granted Jul 10, 2001·443 cites·26 claims
- 0298US6258223B1In-situ electroless copper seed layer enhancement in an electroplating systemAPPLIED MATERIALS INC·Filed 1999·Granted Jul 10, 2001·399 cites·9 claims
- 0396US6436267B1Method for achieving copper fill of high aspect ratio interconnect featuresAPPLIED MATERIALS INC·Filed 2000·Granted Aug 20, 2002·105 cites·35 claims
- 0493US5916369AGas inlets for wafer processing chamberAPPLIED MATERIALS INC·Filed 1995·Granted Jun 29, 1999·117 cites·9 claims
- 0591US6635157B2Electro-chemical deposition systemAPPLIED MATERIALS INC·Filed 2001·Granted Oct 21, 2003·43 cites·68 claims
- 0689US6494219B1Apparatus with etchant mixing assembly for removal of unwanted electroplating depositsAPPLIED MATERIALS INC·Filed 2000·Granted Dec 17, 2002·47 cites·19 claims
- 0787US7497932B2Electro-chemical deposition systemAPPLIED MATERIALS INC·Filed 2006·Granted Mar 3, 2009·9 cites·4 claims
- 0875US6500734B2Gas inlets for wafer processing chamberAPPLIED MATERIALS INC·Filed 1999·Granted Dec 31, 2002·45 cites·21 claims
- 0968US6893548B2Method of conditioning electrochemical baths in plating technologyAPPLIED MATERIALS INC·Filed 2001·Granted May 17, 2005·5 cites·8 claims
- 1056US6808612B2Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratioAPPLIED MATERIALS INC·Filed 2001·Granted Oct 26, 2004·7 cites·17 claims
- 1145US2004104119A1Small volume electroplating cellAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 1243US2004084301A1Electro-chemical deposition systemAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 1339US2003000844A1Method for achieving copper fill of high aspect ratio interconnect featuresAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 1439US2003038107A1Method and apparatus for removal of unwanted electroplating depositsAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 1536US2002043466A1Method and apparatus for patching electrochemically deposited layers using electroless deposited materialsAPPLIED MATERIALS INC·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →