Small volume electroplating cell

Abstract

A method and apparatus for plating a metal onto a substrate. The apparatus generally The apparatus generally includes a substrate support member configured to support a substrate during a plating process, a cathode clamp ring detachably positioned to circumscribe a perimeter of the substrate and a movable anode assembly disposed above the substrate, wherein the anode assembly is movable in a direction generally perpendicular the substrate. The apparatus generally further includes a fluid inlet formed through the anode assembly, the fluid inlet being configured to supply a plating solution to the processing area sufficient to electrically connect the anode assembly to the substrate. The method generally includes supplying a plating solution to a processing chamber, the processing chamber being defined by a movable anode assembly disposed above the substrate and a cathode clamp ring detachably positioned to circumscribe the perimeter of the substrate, wherein the plating solution is supplied at a rate sufficient to electrically connect the anode assembly to the substrate and plating a metal from the plating solution onto the substrate.

What is claimed is:  
     
         1 . An apparatus for plating a metal onto a substrate surface, comprising: 
 a substrate support member configured to support a substrate during a plating process;    a cathode clamp ring detachably positioned to circumscribe a perimeter of the substrate;    a movable anode assembly disposed above the substrate, wherein the anode assembly is movable in a direction generally perpendicular the substrate; and    a fluid inlet formed through the anode assembly, the fluid inlet being configured to supply a plating solution to the processing area sufficient to electrically connect the anode assembly to the substrate.    
     
     
         2 . The apparatus of  claim 1 , wherein the movable anode assembly is configured to adjust a distance between an anode plate of the anode assembly and the substrate.  
     
     
         3 . The apparatus of  claim 2 , wherein the distance is between about 2 mm and about 20 mm.  
     
     
         4 . The apparatus of  claim 1 , wherein movable anode assembly includes a disk shaped anode plate surrounded by an annular hood member.  
     
     
         5 . The apparatus of  claim 3 , wherein the hood member is manufactured from an insulating material.  
     
     
         6 . The apparatus of  claim 4 , wherein the hood member is manufactured from a metal and is connected to a power source to selectively control current passing between the anode plate and the substrate.  
     
     
         7 . The apparatus of  claim 1 , wherein movable anode assembly comprises a disk shaped anode plate having an aperture formed therein, the aperture forming the fluid inlet.  
     
     
         8 . The apparatus of  claim 7 , wherein the anode plate is positioned in parallel relationship to a plating surface of the substrate.  
     
     
         9 . The apparatus of  claim 7 , further comprising an actuator configured to actuate the anode plate toward and away from the substrate.  
     
     
         10 . The apparatus of  claim 1 , wherein the cathode clamp ring is configured to be positioned over an upper perimeter surface of the substrate support member in a manner such that the cathode clamp ring electrically engages the perimeter portion of the substrate and forms a processing volume above the substrate and within the clamp ring.  
     
     
         11 . The apparatus of  claim 10 , wherein the processing volume is as deep as the cathode clamp ring is tall and is sized to receive an anode plate therein.  
     
     
         12 . A method for plating a metal onto a substrate, comprising: 
 supplying a plating solution to a processing volume, the processing volume being defined by a movable anode assembly disposed above the substrate and a cathode clamp ring detachably positioned to circumscribe a perimeter of the substrate, wherein the plating solution is supplied at a rate sufficient to electrically connect the anode assembly to the substrate; and    plating a metal from the plating solution onto the substrate.    
     
     
         13 . The method of  claim 12 , further comprising moving the anode assembly to define a distance between the anode plate and the plating surface.  
     
     
         14 . The method of  claim 12 , wherein the anode assembly comprises an anode plate including a plurality of metal segments, the plurality of metal segments being separately controlled by a power source to provide uniform metal deposition.  
     
     
         15 . The method of  claim 14 , wherein the plurality of metal segments are separated by an insulating material.  
     
     
         16 . The method of  claim 12 , wherein the anode assembly further comprises a hood depending from the periphery of the anode plate.  
     
     
         17 . The method of  claim 16 , further comprising releasing electrolyte from the processing chamber through an annular opening, the annular opening being defined by a distance between the hood and the cathode clamp ring.  
     
     
         18 . The method of  claim 17 , further comprising supplying plating solution to the processing chamber at a rate essentially equal to the rate of release.  
     
     
         19 . The method of  claim 12 , further comprising rotating the substrate.  
     
     
         20 . The method of  claim 12 , further comprising adjusting the anode assembly to form a cell chamber having a volume of from about 0.5 L to about 1.9 L.  
     
     
         21 . The method of  claim 14 , wherein the distance between the substrate and the anode plate is between about 2 mm and 20 mm.  
     
     
         22 . The method of  claim 14 , wherein the distance between the substrate and the anode plate is between about 2 mm and about 10 mm.  
     
     
         23 . An electrochemical processing cell, comprising: 
 a substrate support member having a circular upper substrate support surface formed thereon;    an annular cathode contact ring configured to releasably engage an outer perimeter of the substrate support surface and electrically contact a substrate positioned thereon; and    a disk shaped anode configured to be received within an inner diameter of the annular cathode contact ring, the disk shaped anode being movable between an processing position and a loading position.    
     
     
         24 . The processing cell of  claim 23 , wherein the disk shaped anode further comprises a fluid inlet configured to deliver a processing fluid to a processing volume defined by the anode, the cathode contact ring, and the substrate.  
     
     
         25 . The processing cell of  claim 23 , wherein the contact ring forms an annular wall above the substrate, the annular wall being configured to maintain a volume of a plating solution therein.  
     
     
         26 . The processing cell of  claim 23 , wherein the anode further comprises a hood member.