Inventor · disambiguated record
Tae Ki Hong
Also filed as: HONG TAE-KI
10 granted patents·7 pending applications·9 citations·filing 2010–2024
82Inventor score
Top patents by PatentIndex Score
17 records- 0178US10020248B2Tape for electronic devices with reinforced lead crackLG INNOTEK CO LTD·Filed 2016·Granted Jul 10, 2018·3 cites·10 claims
- 0273US2025110616A1Method of selecting one or more items according to user input and electronic device thereforSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0369US9105631B2Carrier tape for tab-package and manufacturing method thereofLG INNOTEK CO LTD·Filed 2014·Granted Aug 11, 2015·2 cites·10 claims
- 0468US12197700B2Method of selecting one or more items according to user input and electronic device thereforSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 14, 2025·0 cites·19 claims
- 0564US8791370B2Carrier tape for tab-package and manufacturing method thereofHONG TAE KI·Filed 2010·Granted Jul 29, 2014·2 cites·8 claims
- 0662US10020280B2Method of manufacturing a carrier tapeLG INNOTEK CO LTD·Filed 2015·Granted Jul 10, 2018·1 cites·10 claims
- 0758US9480152B2Carrier tape for tab-package and manufacturing method thereofHONG TAE KI·Filed 2011·Granted Oct 25, 2016·1 cites·11 claims
- 0857US11681411B2Method of selecting one or more items according to user input and electronic device thereforSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 20, 2023·0 cites·19 claims
- 0953US10251615B2X-ray imaging deviceVATECH CO LTD·Filed 2014·Granted Apr 9, 2019·0 cites·9 claims
- 1050US9648731B2Carrier tape for tab-package and manufacturing method thereofLG INNOTEK CO LTD·Filed 2014·Granted May 9, 2017·0 cites·18 claims
- 1144US2013308289A1Tape for electronic devices with reinforced lead crackYOO DAE SUNG·Filed 2011·Application pending·0 cites
- 1243US2016124589A1Method of selecting one or more items according to user input and electronic device thereforSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 1341US2015284847A1Method of Forming an Epitaxial Layer and Apparatus for Processing a Substrate Used for the MethodSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 1440US2013126094A1Substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 1539US8956970B1Method of forming semiconductor device having multilayered plug and related deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Feb 17, 2015·0 cites·15 claims
- 1638US2019013180A1Plasma treatment apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 1735US2017338232A1Method of fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →