Tape for electronic devices with reinforced lead crack

Abstract

Provided is a tape for electronic devices with lead crack and a method of manufacturing the tape. According to the present invention, by forming a bending portion on a narrow circuit pattern to be connected from an inner lead to an outer lead and further forming the bending portion within a resin application portion, crack occurred in a narrow wiring width can be avoided. The tape may include a first lead and a second lead formed on a dielectric substrate and a bending portion formed on one of the first lead and the second lead wherein the bending portion is formed within a resin application portion.

1 - 18 . (canceled) 
     
     
         19 . A tape for electronic devices:
 a first lead and a second lead formed on a dielectric substrate; and   a bending portion formed on one of the first lead and the second lead.   
     
     
         20 . The tape for electronic devices of  claim 19 , wherein the bending portion has a structure in which the bending portion forms an angle of inclination with the second lead and in a longitudinal direction of the second lead. 
     
     
         21 . The tape for electronic devices of  claim 20 , wherein the bending portion is formed on one of the first lead and the second lead. 
     
     
         22 . The tape for electronic devices of  claim 21 , wherein the bending portion is less than one width of a width of the first lead and a width of the second lead. 
     
     
         23 . The tape for electronic devices of  claim 20 , wherein at least one or more different distances among patterns of the first lead and the second lead exist. 
     
     
         24 . The tape for electronic devices of  claim 21 , wherein the bending portion comprises a connecting pattern for the first lead and the second lead. 
     
     
         25 . The tape for electronic devices of  claim 24 , wherein the connecting pattern connects the first lead and the second lead in a bending form. 
     
     
         26 . The tape for electronic devices of  claim 25 , further comprising a resin application portion on the dielectric substrate. 
     
     
         27 . The tape for electronic devices of  claim 26 , wherein the resin application portion is formed over a chip mounting portion on the dielectric substrate. 
     
     
         28 . The tape for electronic devices of  claim 26 , wherein the bending portion is included within the resin application portion. 
     
     
         29 . The tape for electronic devices of  claim 28 , wherein the width of the first lead and the width of the second lead are different from each other. 
     
     
         30 . The tape for electronic devices of  claim 29 , wherein a pattern width of the first lead is wider than that of the second lead. 
     
     
         31 . The tape for electronic devices of  claim 28 , further comprising an electronic device chip mounted to the chip mounting portion, and resin for burying a circumference of the electronic device chip in the resin application portion. 
     
     
         32 . The tape for electronic devices of  claim 31 , wherein the resin is a potting material having viscosity. 
     
     
         33 . The tape for electronic devices of  claim 31 , wherein the resin comprises epoxy. 
     
     
         34 . The tape for electronic devices of  claim 33 , wherein the resin further comprises a curing material and an inorganic filler. 
     
     
         35 . The tape for electronic devices of  claim 28 , wherein the dielectric substrate is a polyimide film. 
     
     
         36 . The tape for electronic devices of  claim 28 , wherein a plating treatment layer of a different material from those of the first lead and the second lead is included on the first lead and the second lead. 
     
     
         37 . The tape for electronic devices of  claim 36 , wherein the plating treatment layer is made of one material selected from the group consisting of Cu, Ni, Pd, Au, Sn, Ag and Co, or a binary or ternary alloy thereof 
     
     
         38 . The tape for electronic devices of  claim 37 , wherein the plating treatment layer has a multi-layer structure.