Inventor · disambiguated record
Chun Ho Fan
Also filed as: FAN CHUN H · FAN CHUN HO
51 granted patents·11 pending applications·4,143 citations·filing 2000–2023
99Inventor score
Files withASAT LTD41UBOTIC COMPANY LTD6ASM TECH SINGAPORE PTE LTD3ASMPT SINGAPORE PTE LTD2FAN CHUN HO2
Top patents by PatentIndex Score
62 records- 0199US7482690B1Electronic components such as thin array plastic packages and process for fabricating sameASAT LTD·Filed 2005·Granted Jan 27, 2009·86 cites·15 claims
- 0299US7372151B1Ball grid array package and process for manufacturing sameASAT LTD·Filed 2003·Granted May 13, 2008·461 cites·8 claims
- 0398US6995460B1Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2005·Granted Feb 7, 2006·119 cites·19 claims
- 0498US6946324B1Process for fabricating a leadless plastic chip carrierASAT LTD·Filed 2003·Granted Sep 20, 2005·182 cites·10 claims
- 0598US6635957B2Leadless plastic chip carrier with etch back pad singulation and die attach pad arrayASAT LTD·Filed 2001·Granted Oct 21, 2003·199 cites·13 claims
- 0697US7009286B1Thin leadless plastic chip carrierASAT LTD·Filed 2004·Granted Mar 7, 2006·117 cites·11 claims
- 0797US6933176B1Ball grid array package and process for manufacturing sameASAT LTD·Filed 2003·Granted Aug 23, 2005·121 cites·23 claims
- 0896US7247526B1Process for fabricating an integrated circuit packageASAT LTD·Filed 2005·Granted Jul 24, 2007·134 cites·14 claims
- 0996US7226811B1Process for fabricating a leadless plastic chip carrierASAT LTD·Filed 2005·Granted Jun 5, 2007·55 cites·3 claims
- 1096US6989294B1Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2003·Granted Jan 24, 2006·101 cites·8 claims
- 1196US6987032B1Ball grid array package and process for manufacturing sameASAT LTD·Filed 2003·Granted Jan 17, 2006·126 cites·29 claims
- 1296US6964918B1Electronic components such as thin array plastic packages and process for fabricating sameASAT LTD·Filed 2004·Granted Nov 15, 2005·84 cites·15 claims
- 1396US6933594B2Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2001·Granted Aug 23, 2005·140 cites·12 claims
- 1495US7271032B1Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2005·Granted Sep 18, 2007·43 cites·29 claims
- 1595US7081403B1Thin leadless plastic chip carrierASAT LTD·Filed 2005·Granted Jul 25, 2006·28 cites·14 claims
- 1695US7049177B1Leadless plastic chip carrier with standoff contacts and die attach padASAT LTD·Filed 2004·Granted May 23, 2006·192 cites·11 claims
- 1795US6818978B1Ball grid array package with shieldingASAT LTD·Filed 2002·Granted Nov 16, 2004·112 cites·15 claims
- 1895US6585905B1Leadless plastic chip carrier with partial etch die attach padASAT LTD·Filed 2002·Granted Jul 1, 2003·226 cites·16 claims
- 1994US7371610B1Process for fabricating an integrated circuit package with reduced mold warpingASAT LTD·Filed 2004·Granted May 13, 2008·79 cites·26 claims
- 2094US7315080B1Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreaderASAT LTD·Filed 2004·Granted Jan 1, 2008·76 cites·5 claims
- 2194US7091581B1Integrated circuit package and process for fabricating the sameASAT LTD·Filed 2004·Granted Aug 15, 2006·122 cites·9 claims
- 2294US6979594B1Process for manufacturing ball grid array packageASAT LTD·Filed 2002·Granted Dec 27, 2005·92 cites·14 claims
- 2394US6781242B1Thin ball grid array packageASAT LTD·Filed 2002·Granted Aug 24, 2004·91 cites·12 claims
- 2494US6734552B2Enhanced thermal dissipation integrated circuit packageASAT LTD·Filed 2001·Granted May 11, 2004·241 cites·24 claims
- 2593US7411289B1Integrated circuit package with partially exposed contact pads and process for fabricating the sameASAT LTD·Filed 2004·Granted Aug 12, 2008·101 cites·14 claims
- 2693US6818472B1Ball grid array packageASAT LTD·Filed 2003·Granted Nov 16, 2004·69 cites·3 claims
- 2793US6800948B1Ball grid array packageASAT LTD·Filed 2002·Granted Oct 5, 2004·74 cites·6 claims
- 2892US6734044B1Multiple leadframe laminated IC packageASAT LTD·Filed 2002·Granted May 11, 2004·78 cites·9 claims
- 2990US7232755B1Process for fabricating pad frame and integrated circuit packageASAT LTD·Filed 2005·Granted Jun 19, 2007·20 cites·21 claims
- 3090US6982491B1Sensor semiconductor package and method of manufacturing the sameASAT LTD·Filed 2004·Granted Jan 3, 2006·91 cites·14 claims
- 3189US6429048B1Metal foil laminated IC packageASAT LTD·Filed 2000·Granted Aug 6, 2002·78 cites·14 claims
- 3288US7449771B1Multiple leadframe laminated IC packageASAT LTD·Filed 2003·Granted Nov 11, 2008·56 cites·5 claims
- 3388US6872661B1Leadless plastic chip carrier with etch back pad singulation and die attach pad arrayASAT LTD·Filed 2002·Granted Mar 29, 2005·53 cites·19 claims
- 3487US7015072B2Method of manufacturing an enhanced thermal dissipation integrated circuit packageASAT LTD·Filed 2004·Granted Mar 21, 2006·54 cites·18 claims
- 3587US6790710B2Method of manufacturing an integrated circuit packageASAT LTD·Filed 2002·Granted Sep 14, 2004·56 cites·48 claims
- 3686US10115579B2Method for manufacturing wafer-level semiconductor packagesASM TECH SINGAPORE PTE LTD·Filed 2017·Granted Oct 30, 2018·4 cites·20 claims
- 3785US7410830B1Leadless plastic chip carrier and method of fabricating sameASAT LTD·Filed 2005·Granted Aug 12, 2008·22 cites·22 claims
- 3883US7595225B1Leadless plastic chip carrier with contact standoffFAN CHUN HO·Filed 2004·Granted Sep 29, 2009·67 cites·16 claims
- 3983US7270867B1Leadless plastic chip carrierASAT LTD·Filed 2004·Granted Sep 18, 2007·34 cites·11 claims
- 4080US9257370B2Cavity package with pre-molded cavity leadframeUBOTIC COMPANY LTD·Filed 2014·Granted Feb 9, 2016·3 cites·15 claims
- 4179US9536812B2Cavity package with pre-molded cavity leadframeUBOTIC COMPANY LTD·Filed 2016·Granted Jan 3, 2017·2 cites·4 claims
- 4277US9659855B2Cavity package with pre-molded substrateUBOTIC COMPANY LTD·Filed 2014·Granted May 23, 2017·3 cites·6 claims
- 4376US9601413B2Cavity package with die attach padUBOTIC COMPANY LTD·Filed 2014·Granted Mar 21, 2017·3 cites·5 claims
- 4474US8330270B1Integrated circuit package having a plurality of spaced apart pad portionsLIN GERALDINE TSUI YEE·Filed 2004·Granted Dec 11, 2012·22 cites·15 claims
- 4570US6903304B1Process for dressing molded array package saw bladeASAT LTD·Filed 2003·Granted Jun 7, 2005·15 cites·7 claims
- 4661US2010089554A1Drum-based vapor chamber with an insertable wick systemLEE STEVE HON-KEUNG·Filed 2008·Application pending·0 cites
- 4759US2025157830A1Method for manufacturing integrated device packagesASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 4858US7033517B1Method of fabricating a leadless plastic chip carrierASAT LTD·Filed 2003·Granted Apr 25, 2006·8 cites·16 claims
- 4953US9887149B2Cavity package with die attach padUBOTIC COMPANY LTD·Filed 2017·Granted Feb 6, 2018·0 cites·16 claims
- 5052US2024339430A1System and method for fluxless thermocompression bondingASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
Showing the top 50 of 62 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →