Drum-based vapor chamber with an insertable wick system

Abstract

A vapor chamber with an insertable wick system comprises two Coverskins and a Frame, where the insertable wick system provides at least a portion of a condensate flow path from the condensing surface to an evaporation region. The Coverskins are joined to the frame to form a “drum” enclosure whereby, similar to membranes on a drum, the two Coverskins resist deformation mainly through tensile forces along the plane of the skins, and thus much thinner materials could be used. The frame operates similar to the cylindrical body of a drum in providing the necessary bending resistance so as to keep the Coverskins in a state of relative tension when it is subject to external loading. The net result of this arrangement is that each component would largely be responsible for only one type of force (i.e., tension or bending), and thus a state of maximum efficiency could be achieved. Consequently, the strength of the Coverskins (to resist collapse) is less dependent on its thickness, and a state of minimum thickness is achieved.

1 . A vapor chamber comprising at least two coverskins and a frame; wherein the frame comprises at least one bracket; wherein at least one of the coverskins and frame is made of metal, laminated metals, metal-polymer composites or a combination thereof; and wherein wicks are operationally disposed on the interior surfaces of the said vapor chamber. 
   
   
       2 . The vapor chamber of  claim 1  wherein at least one of the coverskins contains at least one integrated fin or pin. 
   
   
       3 . A vapor chamber comprising a frame, at least one coverskin, and an insertable wick system that provides at least a portion of a condensate flow path from a condensing surface to an evaporation region. 
   
   
       4 . The vapor chamber of  claim 3 , wherein the said insertable wick system comprises a retainer with an optional fill-in wick; wherein the retainer comprises a wire frame or a folded plate and the optional fill-in wick comprises of wire mesh, un-sintered metallic powder, or a combination thereof. 
   
   
       5 . The vapor chamber of  claim 4 , wherein the folded plate has at least one groove formed thereon. 
   
   
       6 . The vapor chamber of  claims 1 , wherein the wick structure further constitutes a Multi-Wick structure wherein the wicking power at the evaporation region is higher than at the condensation region. 
   
   
       7 . The vapor chamber of  claim 6 , wherein the said Multi-Wick structure further constitutes a Boiling-Enhanced Multi-Wick structure. 
   
   
       8 . The vapor chamber of  claim 7 , wherein grooves, mesh, or a combination thereof are functionally disposed onto the condensation surface; fins, pins, pins-fins, sintered powder, mesh structures or a combination thereof are used as the boiling enhancement structure; layered structures comprising at least one of: plates, mesh and grooved surfaces are used at regions in functional contact with the boiling enhancement structure. 
   
   
       9 . A heat transfer device, comprising:
 a frame;   a top and a bottom coverskin coupled to the frame at a top and a bottom of the frame, respectively, thereby forming a region for accepting a wick structure.   
   
   
       10 . The heat transfer device of  claim 9 , wherein the bottom cover skin includes a region for the wick structure to be in communication with a heat producing device. 
   
   
       11 . The heat transfer device of  claim 9 , further comprising fins coupled to the top coverskin. 
   
   
       12 . The heat transfer device of  claim 9 , wherein the wick structure includes grooves, mesh, sintered powder or any combination thereof. 
   
   
       13 . The heat transfer device of  claim 9 , wherein the frame comprises one of more brackets to strengthen the frame. 
   
   
       14 . The heat transfer device of  claim 9 , wherein the frame further comprises a charging tube capable of being connected to vacuum pump and liquid supply. 
   
   
       15 . The heat transfer device of  claim 9 , wherein the insertable wick structure includes a folded sheet with groove structures to channel condensate away from the top coverskin towards an evaporation region of the bottom coverskin. 
   
   
       16 . The heat transfer device of  claim 9 , wherein the insertable wick structure includes a multi-wick structure wherein a wicking power of a wick on a condensing surface of the multi-wick structure is less than that at an evaporation region at the bottom coverskin. 
   
   
       17 . A method for constructing a vapor chamber whereby an insertable wick is utilized to bridge the wicks at condensation and evaporation surfaces; wherein the wicks at the condensation or evaporation surfaces comprise of mesh, grooves, fins, pins, pins-fins, sintered powder or a combination thereof; wherein at least one component of the insertable wick is only in mechanical contact with at least one surface of the vapor chamber; and wherein the vapor chamber comprises wick structures and vaporizable fluids. 
   
   
       18 . An insertable wick system that provides at least a portion of a condensate flow path from a condensing surface to an evaporation region; wherein the said insertable wick system comprises a retainer with an optional fill-in wick 
   
   
       19 . The wick system of  claim 18  wherein the retainer comprises a wire frame or a folded plate. 
   
   
       20 . The wick system of  claim 18  wherein the optional fill-in wick comprises of wire mesh, un-sintered metallic powder, or a combination thereof. 
   
   
       21 . The wick system of  claim 18  wherein the folded plate has at least one groove formed thereon