Assignee
ASAT LTD
HK·68 granted patents·1 pending application·8,906 citations·filing 1993–2007
Top patents by PatentIndex Score
69 records- 0199US7482690B1Electronic components such as thin array plastic packages and process for fabricating sameASAT LTD·Filed 2005·Granted Jan 27, 2009·86 cites·15 claims
- 0299US7372151B1Ball grid array package and process for manufacturing sameASAT LTD·Filed 2003·Granted May 13, 2008·461 cites·8 claims
- 0398US6995460B1Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2005·Granted Feb 7, 2006·119 cites·19 claims
- 0498US6946324B1Process for fabricating a leadless plastic chip carrierASAT LTD·Filed 2003·Granted Sep 20, 2005·182 cites·10 claims
- 0598US6635957B2Leadless plastic chip carrier with etch back pad singulation and die attach pad arrayASAT LTD·Filed 2001·Granted Oct 21, 2003·199 cites·13 claims
- 0698US6498099B1Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 1999·Granted Dec 24, 2002·519 cites·12 claims
- 0798US6242281B1Saw-singulated leadless plastic chip carrierASAT LTD·Filed 1999·Granted Jun 5, 2001·413 cites·12 claims
- 0898US6229200B1Saw-singulated leadless plastic chip carrierASAT LTD·Filed 1998·Granted May 8, 2001·556 cites·9 claims
- 0997US7358119B2Thin array plastic package without die attach pad and process for fabricating the sameASAT LTD·Filed 2005·Granted Apr 15, 2008·78 cites·24 claims
- 1097US7348663B1Integrated circuit package and method for fabricating sameASAT LTD·Filed 2005·Granted Mar 25, 2008·135 cites·9 claims
- 1197US7344920B1Integrated circuit package and method for fabricating sameASAT LTD·Filed 2007·Granted Mar 18, 2008·89 cites·9 claims
- 1297US7009286B1Thin leadless plastic chip carrierASAT LTD·Filed 2004·Granted Mar 7, 2006·117 cites·11 claims
- 1397US6933176B1Ball grid array package and process for manufacturing sameASAT LTD·Filed 2003·Granted Aug 23, 2005·121 cites·23 claims
- 1497US6724071B2Molded plastic package with heat sink and enhanced electrical performanceASAT LTD·Filed 2002·Granted Apr 20, 2004·180 cites·18 claims
- 1597US6545347B2Enhanced leadless chip carrierASAT LTD·Filed 2001·Granted Apr 8, 2003·148 cites·5 claims
- 1696US7342305B1Thermally enhanced cavity-down integrated circuit packageASAT LTD·Filed 2005·Granted Mar 11, 2008·64 cites·9 claims
- 1796US7247526B1Process for fabricating an integrated circuit packageASAT LTD·Filed 2005·Granted Jul 24, 2007·134 cites·14 claims
- 1896US7226811B1Process for fabricating a leadless plastic chip carrierASAT LTD·Filed 2005·Granted Jun 5, 2007·55 cites·3 claims
- 1996US6989294B1Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2003·Granted Jan 24, 2006·101 cites·8 claims
- 2096US6987032B1Ball grid array package and process for manufacturing sameASAT LTD·Filed 2003·Granted Jan 17, 2006·126 cites·29 claims
- 2196US6964918B1Electronic components such as thin array plastic packages and process for fabricating sameASAT LTD·Filed 2004·Granted Nov 15, 2005·84 cites·15 claims
- 2296US6933594B2Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2001·Granted Aug 23, 2005·140 cites·12 claims
- 2396US6294100B1Exposed die leadless plastic chip carrierASAT LTD·Filed 1999·Granted Sep 25, 2001·349 cites·11 claims
- 2496US5843808AStructure and method for automated assembly of a tab grid array packageASAT LTD·Filed 1996·Granted Dec 1, 1998·218 cites·9 claims
- 2595US7271032B1Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2005·Granted Sep 18, 2007·43 cites·29 claims
- 2695US7081403B1Thin leadless plastic chip carrierASAT LTD·Filed 2005·Granted Jul 25, 2006·28 cites·14 claims
- 2795US7049177B1Leadless plastic chip carrier with standoff contacts and die attach padASAT LTD·Filed 2004·Granted May 23, 2006·192 cites·11 claims
- 2895US6818978B1Ball grid array package with shieldingASAT LTD·Filed 2002·Granted Nov 16, 2004·112 cites·15 claims
- 2995US6585905B1Leadless plastic chip carrier with partial etch die attach padASAT LTD·Filed 2002·Granted Jul 1, 2003·226 cites·16 claims
- 3095US6285075B1Integrated circuit package with bonding planes on a ceramic ring using an adhesive assemblyASAT LTD·Filed 1998·Granted Sep 4, 2001·280 cites·19 claims
- 3194US7371610B1Process for fabricating an integrated circuit package with reduced mold warpingASAT LTD·Filed 2004·Granted May 13, 2008·79 cites·26 claims
- 3294US7315080B1Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreaderASAT LTD·Filed 2004·Granted Jan 1, 2008·76 cites·5 claims
- 3394US7091581B1Integrated circuit package and process for fabricating the sameASAT LTD·Filed 2004·Granted Aug 15, 2006·122 cites·9 claims
- 3494US6979594B1Process for manufacturing ball grid array packageASAT LTD·Filed 2002·Granted Dec 27, 2005·92 cites·14 claims
- 3594US6818980B1Stacked semiconductor package and method of manufacturing the sameASAT LTD·Filed 2003·Granted Nov 16, 2004·113 cites·14 claims
- 3694US6781242B1Thin ball grid array packageASAT LTD·Filed 2002·Granted Aug 24, 2004·91 cites·12 claims
- 3794US6737755B1Ball grid array package with improved thermal characteristicsASAT LTD·Filed 2002·Granted May 18, 2004·109 cites·14 claims
- 3894US6734552B2Enhanced thermal dissipation integrated circuit packageASAT LTD·Filed 2001·Granted May 11, 2004·241 cites·24 claims
- 3994US6552417B2Molded plastic package with heat sink and enhanced electrical performanceASAT LTD·Filed 2001·Granted Apr 22, 2003·113 cites·1 claims
- 4094US6326678B1Molded plastic package with heat sink and enhanced electrical performanceASAT LTD·Filed 1993·Granted Dec 4, 2001·305 cites·19 claims
- 4194US6284569B1Method of manufacturing a flexible integrated circuit package utilizing an integrated carrier ring/stiffenerASAT LTD·Filed 1999·Granted Sep 4, 2001·181 cites·11 claims
- 4294US5596231AHigh power dissipation plastic encapsulated package for integrated circuit dieASAT LTD·Filed 1994·Granted Jan 21, 1997·203 cites·18 claims
- 4393US7411289B1Integrated circuit package with partially exposed contact pads and process for fabricating the sameASAT LTD·Filed 2004·Granted Aug 12, 2008·101 cites·14 claims
- 4493US6818472B1Ball grid array packageASAT LTD·Filed 2003·Granted Nov 16, 2004·69 cites·3 claims
- 4593US6800948B1Ball grid array packageASAT LTD·Filed 2002·Granted Oct 5, 2004·74 cites·6 claims
- 4692US7071545B1Shielded integrated circuit packageASAT LTD·Filed 2002·Granted Jul 4, 2006·106 cites·7 claims
- 4792US6984785B1Thermally enhanced cavity-down integrated circuit packageASAT LTD·Filed 2003·Granted Jan 10, 2006·75 cites·9 claims
- 4892US6940154B2Integrated circuit package and method of manufacturing the integrated circuit packageASAT LTD·Filed 2002·Granted Sep 6, 2005·110 cites·99 claims
- 4992US6734044B1Multiple leadframe laminated IC packageASAT LTD·Filed 2002·Granted May 11, 2004·78 cites·9 claims
- 5092US6111324AIntegrated carrier ring/stiffener and method for manufacturing a flexible integrated circuit packageASAT LTD·Filed 1998·Granted Aug 29, 2000·137 cites·9 claims
Showing the top 50 of 69 patent records by PatentIndex Score.
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