Inventor · disambiguated record
Hitoshi Kosugi
Also filed as: KOSUGI HITOSHI
18 granted patents·3 pending applications·81 citations·filing 2000–2022
91Inventor score
Top patents by PatentIndex Score
21 records- 0189US11545367B2Substrate processing apparatus, substrate processing method, and chemical liquidTOKYO ELECTRON LTD·Filed 2021·Granted Jan 3, 2023·2 cites·10 claims
- 0288US6267516B1Developing apparatus and developing nozzleTOKYO ELECTRON LTD·Filed 2000·Granted Jul 31, 2001·35 cites·20 claims
- 0387US11217451B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Jan 4, 2022·2 cites·12 claims
- 0483US6496245B2Developing method and developing apparatusTOKYO ELECTRON LTD·Filed 2001·Granted Dec 17, 2002·23 cites·13 claims
- 0580US11309194B2Substrate liquid treatment apparatusTOKYO ELECTRON LTD·Filed 2018·Granted Apr 19, 2022·3 cites·11 claims
- 0677US8376637B2Photoresist coating and developing apparatus, substrate transfer method and interface apparatusTOKYO ELECTRON LTD·Filed 2010·Granted Feb 19, 2013·4 cites·28 claims
- 0772US12371796B2Substrate processing apparatus, substrate processing method, and chemical liquidTOKYO ELECTRON LTD·Filed 2022·Granted Jul 29, 2025·0 cites·11 claims
- 0872US12002687B2System and methods for wafer dryingTOKYO ELECTRON LTD·Filed 2022·Granted Jun 4, 2024·0 cites·16 claims
- 0968US7924396B2Coating/developing apparatus and pattern forming methodTOKYO ELECTRON LTD·Filed 2007·Granted Apr 12, 2011·3 cites·20 claims
- 1067US7733472B2Method and system for determining condition of process performed for coating film before immersion light exposureTOKYO ELECTRON LTD·Filed 2007·Granted Jun 8, 2010·2 cites·9 claims
- 1165US6780940B2Adhesive resin composition and method for separating adherends bonded together by the compositionTOYO BOSEKI·Filed 2001·Granted Aug 24, 2004·5 cites·6 claims
- 1263US2022059357A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 1362US11515178B2System and methods for wafer dryingTOKYO ELECTRON LTD·Filed 2020·Granted Nov 29, 2022·0 cites·18 claims
- 1461US7651285B2Edge exposure apparatus, coating and developing apparatus, edge exposure method and coating and developing method, and storage mediumTOKYO ELECTRON LTD·Filed 2007·Granted Jan 26, 2010·1 cites·10 claims
- 1545US8420303B2Substrate processing method, computer-readable storage medium and substrate processing systemYAMADA YOSHIAKI·Filed 2010·Granted Apr 16, 2013·0 cites·3 claims
- 1645US7431040B2Method and apparatus for dispensing a rinse solution on a substrateTOKYO ELECTRON LTD·Filed 2003·Granted Oct 7, 2008·1 cites·11 claims
- 1744US8133663B2Pattern forming method and apparatusYAMAMOTO TARO·Filed 2007·Granted Mar 13, 2012·0 cites·13 claims
- 1844US2020126817A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
- 1941US7826032B2Circulation system for high refractive index liquid in pattern forming apparatusTOKYO ELECTRON LTD·Filed 2007·Granted Nov 2, 2010·0 cites·8 claims
- 2039US2011143290A1Developing treatment method and computer-readable storage mediumTOKYO ELECTRON LTD·Filed 2010·Application pending·0 cites
- 2138US8889337B2Film forming method, film forming apparatus and pattern forming methodKOSUGI HITOSHI·Filed 2007·Granted Nov 18, 2014·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →