Substrate processing method and substrate processing apparatus

Abstract

A method includes rotating a substrate, supplying a first processing liquid from a first nozzle to the substrate during a first period, and supplying a second processing liquid from a second nozzle to the substrate during a second period. First and second liquid columns are formed by the first and second processing liquids during at least partially overlapped period of the first and second periods, respectively. The shapes and arrangements of the first and second liquid columns satisfy that: at least one of first and second central axis lines of the first and second liquid columns is inclined with respect to a rotational axis line of the substrate, first and second cut surfaces obtained by cutting the first and second liquid columns along a horizontal plane at least partially overlap each other, and any point on the first central axis line is located on the second central axis line.

1 - 18 . (canceled) 
     
     
         19 . A substrate processing apparatus, comprising:
 a substrate holding/rotating part configured to rotate a substrate around a vertical axis while holding the substrate in a horizontal posture;   a first nozzle configured to supply a first processing liquid to the substrate;   a second nozzle configured to supply a second processing liquid to the substrate;   a nozzle holder configured to fixedly hold the first nozzle and the second nozzle so as not to be movable relative to each other;   a liquid receiving cup provided to surround the substrate and configured to receive at least one of the first processing liquid and the second processing liquid scattering from the rotating substrate;   a ceiling plate configured to cover an upper opening of the liquid receiving cup; and   an inert gas supply part configured to supply an inert gas to a space between the ceiling plate covering the upper opening of the liquid receiving cup and a front surface of the substrate held by the substrate holding/rotating part,   wherein the nozzle holder is configured to hold the first nozzle and the second nozzle so that a first central axis line and a first cut surface of a first liquid column formed by the first processing liquid discharged from the first nozzle and a second central axis line and a second cut surface of a second liquid column formed by the second processing liquid discharged from the second liquid column discharged from the second nozzle satisfy the following conditions:   at least one of the first central axis line which is a central axis line of the first liquid column and the second central axis line which is a central axis line of the second liquid column is inclined with respect to a rotational axis line of the substrate;   the first cut surface and the second cut surface obtained by cutting the first liquid column and the second liquid column along a horizontal plane including the front surface of the substrate at least partially overlap each other as viewed in a direction of the rotational axis line; and   all points on the first central axis line are located on the second central axis line as viewed in the direction of the rotational axis line.   
     
     
         20 . The apparatus of  claim 19 , wherein the nozzle holder is fixed to the ceiling plate, or the nozzle holder is configured to be inserted into an opening formed in a central portion of the ceiling plate by a nozzle arm configured to support the nozzle holder. 
     
     
         21 . The apparatus of  claim 19 , wherein the first central axis line is inclined with respect to the vertical axis. 
     
     
         22 . The apparatus of  claim 21 , wherein the first processing liquid and the second processing liquid are the same kind of processing liquids or different kinds of processing liquids. 
     
     
         23 . The apparatus of  claim 19 , wherein the first central axis line is parallel to the vertical axis. 
     
     
         24 . The apparatus of  claim 23 , wherein the first processing liquid and the second processing liquid are the same kind of processing liquids or different kinds of processing liquids. 
     
     
         25 . The apparatus of  claim 19 , wherein the first central axis line and the second central axis line intersect with each other at an angle of 30 degrees or less. 
     
     
         26 . The apparatus of  claim 19 , wherein a center of the first cut surface is in the second cut surface, and a center of the second cut surface is in the first cut surface. 
     
     
         27 . The apparatus of  claim 19 , wherein a distance between a center of the first cut surface and a center of the second cut surface is 2 mm or less. 
     
     
         28 . The apparatus of  claim 19 , wherein a vertical distance from an intersection point of the first central axis line with the second central axis line to the front surface of the substrate is 3 mm or less. 
     
     
         29 . The apparatus of  claim 19 , wherein the first nozzle and the second nozzle are fixed to a common nozzle holder so as not to be movable relative to each other. 
     
     
         30 . The apparatus of  claim 19 , wherein the first processing liquid and the second processing liquid are the same kind of processing liquids or different kinds of processing liquids. 
     
     
         31 . The method of  claim 19 , wherein the first nozzle and the second nozzle are fixed to the ceiling plate so as not to be movable relative to each other, or the first nozzle and the second nozzle are fixed to the nozzle holder so as not to be movable relative to each other, and wherein the nozzle holder is inserted into an opening formed in a central portion of the ceiling plate.