Inventor · disambiguated record
Nancy Dean
Also filed as: DEAN NANCY · DEAN NANCY F · DEAN NANCY R
9 granted patents·13 pending applications·245 citations·filing 1998–2010
90Inventor score
Top patents by PatentIndex Score
22 records- 0188US7521286B2Methods of refining lead-containing materialsHONEYWELL INT INC·Filed 2006·Granted Apr 21, 2009·6 cites·7 claims
- 0287US6676796B2Transferrable compliant fibrous thermal interfaceHONEYWELL INT INC·Filed 2001·Granted Jan 13, 2004·54 cites·28 claims
- 0385US6740972B2Electronic device having fibrous interfaceHONEYWELL INT INC·Filed 2001·Granted May 25, 2004·39 cites·13 claims
- 0483US6713151B1Compliant fibrous thermal interfaceHONEYWELL INT INC·Filed 1999·Granted Mar 30, 2004·67 cites·24 claims
- 0578US6436506B1Transferrable compliant fibrous thermal interfaceHONEYWELL INT INC·Filed 1998·Granted Aug 20, 2002·53 cites·25 claims
- 0667US7608324B2Interface materials and methods of production and use thereofHONEYWELL INT INC·Filed 2002·Granted Oct 27, 2009·8 cites·49 claims
- 0764US6617199B2Electronic device having fibrous interfaceHONEYWELL INT INC·Filed 2001·Granted Sep 9, 2003·11 cites·21 claims
- 0859US7256491B2Thermal interconnect systems methods of production and uses thereofHONEYWELL INT INC·Filed 2004·Granted Aug 14, 2007·7 cites·34 claims
- 0951US2009294115A1Thermal Interconnect System and Production ThereofHONEYWELL INT INC·Filed 2009·Application pending·0 cites
- 1050US9666547B2Method of refining solder materialsWEISER MARTIN W·Filed 2010·Granted May 30, 2017·0 cites·20 claims
- 1148US2008029882A1Thermal Interconnect System and Method of Production ThereofHONEYWELL INT INC·Filed 2007·Application pending·0 cites
- 1248US2004065954A1Semiconductor packages; lead-containing solders and anodes; and methods of removing alpha-emitters from materialsFiled 2003·Application pending·0 cites
- 1346US2007045839A1Lead-containing solder pasteWEISER MARTIN W·Filed 2006·Application pending·0 cites
- 1446US2007045842A1Lead-containing solder bumpsWEISER MARTIN W·Filed 2006·Application pending·0 cites
- 1546US2007045838A1Lead-containing anodesWEISER MARTIN W·Filed 2006·Application pending·0 cites
- 1640US2005040369A1Thermal interface materials; and compositions comprising indium and zincFiled 2002·Application pending·0 cites
- 1738US2007013054A1Thermally conductive materials, solder preform constructions, assemblies and semiconductor packagesRUCHERT BRIAN D·Filed 2005·Application pending·0 cites
- 1835US2006113683A1Doped alloys for electrical interconnects, methods of production and uses thereofDEAN NANCY·Filed 2005·Application pending·0 cites
- 1934US2005000821A1Anodes for electroplating operations, and methods of forming materials over semiconductor substratesFiled 2001·Application pending·0 cites
- 2031US2009027857A1Heat spreader constructions, intergrated circuitry, methods of forming heat spreader constructions, and methods of forming integrated circuitryDEAN NANCY F·Filed 2005·Application pending·0 cites
- 2130US2006040112A1Thermal interconnect and interface systems, methods of production and uses thereofDEAN NANCY·Filed 2003·Application pending·0 cites
- 2229US2007164424A1Thermal interconnect and interface systems, methods of production and uses thereofDEAN NANCY·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →