US2007045839A1PendingUtilityA1
Lead-containing solder paste
Individually held — no corporate assignee on recordPriority: Oct 8, 2002Filed: Nov 2, 2006Published: Mar 1, 2007
Est. expiryOct 8, 2022(expired)· nominal 20-yr term from priority
B23K 35/268B23K 35/025C25C 1/18B23K 35/26C22B 13/06H10W 72/90H10W 72/9415H10W 90/724H10W 72/252H10W 72/251H10W 90/701H10W 74/117H10W 72/20H05K 3/346H05K 3/3485
46
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Claims
Abstract
The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.
Claims
exact text as granted — not AI-modified1 - 17 . (canceled)
18 . A lead-containing solder paste having an alpha flux of less than 0.001 cts/cm 2 /hr, the lead-containing solder paste comprising at least about 50 weight % lead.
19 . The solder paste of claim 18 having an alpha flux of less than 0.0005 cts/cm 2 /hr.
20 . The solder paste of claim 18 having an alpha flux of less than 0.0002 cts/cm 2 /hr.
21 . The solder paste of claim 18 having an alpha flux of less than 0.0001 cts/cm 2 /hr.
22 - 29 . (canceled)Join the waitlist — get patent alerts
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