Thermal Interconnect System and Production Thereof

Abstract

A thermal transfer material is described herein that includes: a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material, and at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one solder material onto the bottom surface of the heat spreader component.

1 - 56 . (canceled) 
   
   
       57 . A thermal transfer structure, comprising:
 a heat spreader component, wherein the heat spreader component
 comprises a top surface, a bottom surface and at least one heat material; 
   a solder film applied to the top surface, the bottom surface, the at least one heat spreader material or a combination thereof; and   a solder thermal interconnect material applied to the solder film.   
   
   
       58 . The thermal transfer structure of  claim 57 , wherein the solder film or the solder thermal interconnect material comprise indium. 
   
   
       59 . The thermal transfer structure of  claim 57 , wherein the solder film and the solder thermal interconnect material each comprise indium. 
   
   
       60 . The thermal transfer structure of  claim 57 , wherein the solder thermal interconnect material is a preform comprising indium. 
   
   
       61 . The thermal transfer structure of  claim 57 , wherein the solder film or the solder thermal interconnect material comprise tin. 
   
   
       62 . The thermal transfer structure of  claim 57 , wherein the solder film is applied by eletrodeposition. 
   
   
       63 . The thermal transfer structure of  claim 57 , wherein the solder film is applied by masking, silk-screening or a combination thereof. 
   
   
       64 . The thermal transfer structure of  claim 57 , wherein the solder film comprises a film thickness of less than about 25 micrometers. 
   
   
       65 . The thermal transfer structure of  claim 57 , wherein the solder film and the solder thermal interconnect material comprise a total solder thickness of less than about 150 micrometers. 
   
   
       66 . A thermal transfer structure, comprising:
 a heat spreader component, wherein the heat spreader component
 comprises a top surface, a bottom surface and at least one heat spreader material; 
   an indium film applied to the top surface, the bottom surface, the at least one heat spreader material or a combination thereof; and   a solder thermal interconnect material applied to the indium film.   
   
   
       67 . The thermal transfer structure of  claim 66 , wherein the solder thermal interconnect material is a preform comprising indium. 
   
   
       68 . The thermal transfer structure of  claim 66 , wherein the indium film is applied by eletrodeposition. 
   
   
       69 . The thermal transfer structure of  claim 66 , wherein the indium film is applied by masking, silk-screening or a combination thereof. 
   
   
       70 . The thermal transfer structure of  claim 66 , wherein the indium film comprises a film thickness of less than about 25 micrometers. 
   
   
       71 . The thermal transfer structure of  claim 66 , wherein the indium film and the solder thermal interconnect material comprise a total solder thickness of less than about 150 micrometers.