Inventor · disambiguated record
Michael Sugarman
Also filed as: SUGARMAN MICHAEL · SUGARMAN MICHAEL N
36 granted patents·12 pending applications·3,061 citations·filing 1991–2008
98Inventor score
Top patents by PatentIndex Score
48 records- 0199US5656093AWafer spacing mask for a substrate support chuck and method of fabricating sameAPPLIED MATERIALS INC·Filed 1996·Granted Aug 12, 1997·849 cites·29 claims
- 0298US6258220B1Electro-chemical deposition systemAPPLIED MATERIALS INC·Filed 1999·Granted Jul 10, 2001·443 cites·26 claims
- 0397US6416647B1Electro-chemical deposition cell for face-up processing of single semiconductor substratesAPPLIED MATERIALS INC·Filed 1999·Granted Jul 9, 2002·476 cites·25 claims
- 0497US6081414AApparatus for improved biasing and retaining of a workpiece in a workpiece processing systemAPPLIED MATERIALS INC·Filed 1998·Granted Jun 27, 2000·333 cites·24 claims
- 0594US7229504B2Methods and apparatus for determining scrubber brush pressureAPPLIED MATERIALS INC·Filed 2005·Granted Jun 12, 2007·25 cites·15 claims
- 0694US6582578B1Method and associated apparatus for tilting a substrate upon entry for metal depositionAPPLIED MATERIALS INC·Filed 2000·Granted Jun 24, 2003·80 cites·28 claims
- 0792US7513062B2Single wafer dryer and drying methodsAPPLIED MATERIALS INC·Filed 2005·Granted Apr 7, 2009·23 cites·13 claims
- 0891US6635157B2Electro-chemical deposition systemAPPLIED MATERIALS INC·Filed 2001·Granted Oct 21, 2003·43 cites·68 claims
- 0990US6469283B1Method and apparatus for reducing thermal gradients within a substrate supportAPPLIED MATERIALS INC·Filed 1999·Granted Oct 22, 2002·112 cites·16 claims
- 1089US7507296B2Methods and apparatus for determining scrubber brush pressureAPPLIED MATERIALS INC·Filed 2007·Granted Mar 24, 2009·12 cites·8 claims
- 1189US6955516B2Single wafer dryer and drying methodsAPPLIED MATERIALS INC·Filed 2002·Granted Oct 18, 2005·33 cites·20 claims
- 1289US6474712B1Gripper for supporting substrate in a vertical orientationAPPLIED MATERIALS INC·Filed 2000·Granted Nov 5, 2002·42 cites·24 claims
- 1388US7063749B2Scrubber with sonic nozzleAPPLIED MATERIALS INC·Filed 2005·Granted Jun 20, 2006·11 cites·11 claims
- 1488US6551488B1Segmenting of processing system into wet and dry areasAPPLIED MATERIALS INC·Filed 2000·Granted Apr 22, 2003·37 cites·31 claims
- 1587US7980255B2Single wafer dryer and drying methodsAPPLIED MATERIALS INC·Filed 2007·Granted Jul 19, 2011·10 cites·18 claims
- 1687US7497932B2Electro-chemical deposition systemAPPLIED MATERIALS INC·Filed 2006·Granted Mar 3, 2009·9 cites·4 claims
- 1786US6423636B1Process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metalization process on semiconductor waferAPPLIED MATERIALS INC·Filed 1999·Granted Jul 23, 2002·47 cites·16 claims
- 1885US6290865B1Spin-rinse-drying process for electroplated semiconductor wafersAPPLIED MATERIALS INC·Filed 1998·Granted Sep 18, 2001·77 cites·17 claims
- 1984US6986185B2Methods and apparatus for determining scrubber brush pressureAPPLIED MATERIALS INC·Filed 2002·Granted Jan 17, 2006·25 cites·37 claims
- 2084US6797074B2Wafer edge cleaning method and apparatusAPPLIED MATERIALS INC·Filed 2002·Granted Sep 28, 2004·26 cites·15 claims
- 2183US6406359B1Apparatus for transferring semiconductor substrates using an input moduleAPPLIED MATERIALS INC·Filed 2000·Granted Jun 18, 2002·28 cites·20 claims
- 2282US6904637B2Scrubber with sonic nozzleAPPLIED MATERIALS INC·Filed 2001·Granted Jun 14, 2005·23 cites·11 claims
- 2379US6918864B1Roller that avoids substrate slippageAPPLIED MATERIALS INC·Filed 2000·Granted Jul 19, 2005·19 cites·13 claims
- 2479US6516816B1Spin-rinse-dryerAPPLIED MATERIALS INC·Filed 2000·Granted Feb 11, 2003·21 cites·47 claims
- 2579US6219219B1Cathode assembly containing an electrostatic chuck for retaining a wafer in a semiconductor wafer processing systemAPPLIED MATERIALS INC·Filed 1998·Granted Apr 17, 2001·63 cites·20 claims
- 2678US6523553B1Wafer edge cleaning method and apparatusAPPLIED MATERIALS INC·Filed 1999·Granted Feb 25, 2003·45 cites·21 claims
- 2773US6599402B2Electro-chemical deposition cell for face-up processing of single semiconductor substratesAPPLIED MATERIALS INC·Filed 2002·Granted Jul 29, 2003·13 cites·6 claims
- 2872US6520315B1Gripper assemblyAPPLIED MATERIALS INC·Filed 2000·Granted Feb 18, 2003·14 cites·18 claims
- 2971US5356486ACombined wafer support and temperature monitoring deviceAPPLIED MATERIALS INC·Filed 1991·Granted Oct 18, 1994·46 cites·15 claims
- 3066US6728989B2Labyrinth seal for bearing in brush mounting assembly for semiconductor wafer scrubberAPPLIED MATERIALS INC·Filed 2001·Granted May 4, 2004·12 cites·27 claims
- 3162US6921494B2Backside etching in a scrubberAPPLIED MATERIALS INC·Filed 2003·Granted Jul 26, 2005·8 cites·25 claims
- 3258US6820298B2Wafer scrubbing device having brush assembly and mounting assembly forming spherical jointAPPLIED MATERIALS INC·Filed 2001·Granted Nov 23, 2004·6 cites·16 claims
- 3358US2009241996A1Single wafer dryer and drying methodsACHKIRE YOUNES·Filed 2008·Application pending·0 cites
- 3457US2010006124A1Single wafer dryer and drying methodsAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 3551US2006174921A1Single wafer dryer and drying methodsAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3650US2005241684A1Single wafer dryer and drying methodsAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 3749US2006189465A1Roller that avoids substrate slippageAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3848US5567909AMethod for supporting a wafer in a combined wafer support and temperature monitoring deviceAPPLIED MATERIALS INC·Filed 1994·Granted Oct 22, 1996·17 cites·4 claims
- 3948US5129994AMethod and apparatus to inhibit obstruction of optical transmission through semiconductor etch process chamber viewportAPPLIED MATERIALS INC·Filed 1991·Granted Jul 14, 1992·21 cites·25 claims
- 4046US7226514B2Spin-rinse-dryerAPPLIED MATERIALS INC·Filed 2002·Granted Jun 5, 2007·1 cites·17 claims
- 4146US2005109373A1Roller that avoids substrate slippageFiled 2005·Application pending·0 cites
- 4245US6291777B1Conductive feed-through for creating a surface electrode connection within a dielectric body and method of fabricating sameAPPLIED MATERIALS INC·Filed 1999·Granted Sep 18, 2001·11 cites·20 claims
- 4343US2004084301A1Electro-chemical deposition systemAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 4442US2003168346A1Segmenting of processing system into wet and dry areasAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 4542US2004020781A1Electro-chemical deposition cell for face-up processing of single semiconductor substratesAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 4641US2003026683A1Gripper for supporting substrate in a vertical orientationFiled 2002·Application pending·0 cites
- 4738US2003201184A1Method and associated apparatus for tilting a substrate upon entry for metal depositionAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 4835US2002117188A1Wafer presence sensor for detecting quartz wafersFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →