Inventor · disambiguated record
Anand N. Iyer
Also filed as: IYER ANAND N · IYER ANAND NILAKANTAN
11 granted patents·11 pending applications·89 citations·filing 1995–2025
89Inventor score
Top patents by PatentIndex Score
22 records- 0193US7553214B2Polishing article with integrated window stripeAPPLIED MATERIALS INC·Filed 2007·Granted Jun 30, 2009·23 cites·10 claims
- 0286US7601050B2Polishing apparatus with grooved subpadAPPLIED MATERIALS INC·Filed 2007·Granted Oct 13, 2009·11 cites·14 claims
- 0384US10322492B2Retaining ring for CMPAPPLIED MATERIALS INC·Filed 2017·Granted Jun 18, 2019·3 cites·18 claims
- 0481US7179159B2Materials for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Feb 20, 2007·8 cites·17 claims
- 0575US2025375853A1Slurry-based temperature control for cmpAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0674US7841925B2Polishing article with integrated window stripeAPPLIED MATERIALS INC·Filed 2009·Granted Nov 30, 2010·3 cites·20 claims
- 0774US2022281070A1Slurry-based temperature control for cmpAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 0874US2022281061A1Temperature control with intra-layer transition during cmpAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 0973US6811470B2Methods and compositions for chemical mechanical polishing shallow trench isolation substratesAPPLIED MATERIALS INC·Filed 2002·Granted Nov 2, 2004·20 cites·58 claims
- 1071US7429210B2Materials for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2007·Granted Sep 30, 2008·3 cites·18 claims
- 1168US2024042571A1Spray system for slurry reduction during chemical mechanical polishing (cmp)APPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1264US2024334683A1Memory devices and methods of forming the sameAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1363US11819976B2Spray system for slurry reduction during chemical mechanical polishing (cmp)APPLIED MATERIALS INC·Filed 2021·Granted Nov 21, 2023·0 cites·19 claims
- 1461US5882536AMethod and etchant to join ag-clad BSSCO superconducting tapeUNIV CHICAGO·Filed 1995·Granted Mar 16, 1999·18 cites·29 claims
- 1560US11673226B2Retaining ring for CMPAPPLIED MATERIALS INC·Filed 2019·Granted Jun 13, 2023·0 cites·20 claims
- 1657US2014237905A1Method of forming polishing sheetAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 1755US11794305B2Platen surface modification and high-performance pad conditioning to improve CMP performanceAPPLIED MATERIALS INC·Filed 2020·Granted Oct 24, 2023·0 cites·17 claims
- 1851US2010112919A1Monolithic linear polishing sheetAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 1949US2007218693A1High selectivity slurry compositions for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 2046US2006097219A1High selectivity slurry compositions for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 2144US2008182413A1Selective chemistry for fixed abrasive cmpMENK GREGORY E·Filed 2007·Application pending·0 cites
- 2242US2007212976A1Smart polishing media assembly for planarizing substratesAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →