Spray system for slurry reduction during chemical mechanical polishing (cmp)

Abstract

Methods and apparatuses for dispensing polishing fluids onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP apparatus for processing a substrate including a pad disposed on a platen. The pad has a pad radius and a central axis from which the pad radius extends. The apparatus also include a carrier assembly configured to be disposed on a surface of the pad and having a carrier radius that extends from a rotational axis of the carrier assembly and a fluid delivery assembly comprising one or more nozzles, each nozzle coupled to a fast actuating valve.

What is claimed is: 
     
         1 . An apparatus for processing a substrate, comprising:
 a pad disposed on a platen, wherein the pad has a pad radius and a central axis from which the pad radius extends;   a carrier assembly configured to be disposed on a surface of the pad and having a carrier radius that extends from a rotational axis of the carrier assembly; and   a fluid delivery assembly comprising one or more nozzles, each nozzle coupled to a fast actuating valve.   
     
     
         2 . The apparatus of  claim 1 , wherein the fluid delivery assembly is coupled to a pad conditioner arm. 
     
     
         3 . The apparatus of  claim 1 , wherein the fluid delivery assembly comprises at least two nozzles, each nozzle comprising corresponding outlet sizes, wherein each nozzle outlet size is different from at least one other nozzle. 
     
     
         4 . A fluid delivery assembly, comprising:
 an arm;   a plate coupled to the arm; and   one or more fan jet nozzles configured to dispense pressurized fluid having a flat fan jet shape, wherein each nozzle is coupled to a portion of the plate and to a fast actuating valve, wherein a spacing between nozzles is adjustable along a length of the plate.   
     
     
         5 . The fluid delivery assembly of  claim 4 , further comprising an actuator coupled to the plate and configured to move the plate between retracted and extended positions. 
     
     
         6 . The fluid delivery assembly of  claim 5 , wherein the actuator is a linear actuator. 
     
     
         7 . The fluid delivery assembly of  claim 4 , wherein a position of each nozzle is adjustable along a length and a width of a major surface of the plate, wherein the major surface of the plate is on a plane substantially perpendicular to a direction of the one or more nozzles. 
     
     
         8 . The fluid delivery assembly of  claim 4 , wherein a first nozzle of the one or more nozzles is disposed radially outward from a second nozzle of the one or more nozzles, wherein the first nozzle comprises a larger outlet diameter relative to the second nozzle. 
     
     
         9 . The fluid delivery assembly of  claim 4 , wherein each space between each adjacent nozzle is substantially equal to one another. 
     
     
         10 . The fluid delivery assembly of  claim 4 , further comprising an adapter comprising a nozzle clamp, wherein the adapter is coupled to the fast actuating valve, wherein the fast actuating valve is a solenoid valve. 
     
     
         11 . An apparatus for processing a substrate, comprising:
 a pad disposed on a platen, wherein the pad has a pad radius and a central axis from which the pad radius extends;   a carrier assembly configured to be disposed on a surface of the pad and having a carrier radius that extends from a rotational axis of the carrier assembly; and   a fluid delivery assembly comprising one or more nozzles disposed on a plate, each nozzle coupled to a fast actuating valve.   
     
     
         12 . The apparatus of  claim 11 , wherein the plate of the fluid delivery assembly is coupled to an actuator. 
     
     
         13 . The apparatus of  claim 12 , wherein the actuator is coupled a movable block disposed on a rail. 
     
     
         14 . The apparatus of  claim 13 , wherein an extender is disposed between the plate and the block. 
     
     
         15 . The apparatus of  claim 11 , wherein the one or more nozzles are fan jet nozzles. 
     
     
         16 . The apparatus of  claim 11 , wherein the one or more nozzles each comprise a removable outlet, the outlet configured to be exchanged depending on a process. 
     
     
         17 . The apparatus of  claim 11 , wherein the plate further comprises one or more apertures, the apertures configured to enable adjustability of the one or more nozzles. 
     
     
         18 . The apparatus of  claim 11 , wherein the one or more nozzles are directed to a corresponding one or more zones on the pad. 
     
     
         19 . The apparatus of  claim 11 , wherein the one or more nozzles each have a different spray pattern. 
     
     
         20 . The apparatus of  claim 11 , wherein the fluid delivery assembly further comprises one or more adjustment plates disposed between the plate and the one or more nozzles, the adjustment plates comprising apertures configured to enable at least a height adjustment of the one or more nozzles.