Inventor · disambiguated record
Charles Dornfest
Also filed as: DORNFEST CHARLES · DORNFEST CHARLES N
34 granted patents·5 pending applications·6,804 citations·filing 1993–2008
99Inventor score
Top patents by PatentIndex Score
39 records- 0199US6129044AApparatus for substrate processing with improved throughput and yieldAPPLIED MATERIALS INC·Filed 1999·Granted Oct 10, 2000·578 cites·21 claims
- 0299US6099651ATemperature controlled chamber linerAPPLIED MATERIALS INC·Filed 1998·Granted Aug 8, 2000·360 cites·17 claims
- 0399US5882424APlasma cleaning of a CVD or etch reactor using a low or mixed frequency excitation fieldAPPLIED MATERIALS INC·Filed 1997·Granted Mar 16, 1999·325 cites·30 claims
- 0499US5846332AThermally floating pedestal collar in a chemical vapor deposition chamberAPPLIED MATERIALS INC·Filed 1996·Granted Dec 8, 1998·863 cites·22 claims
- 0599US5558717ACVD Processing chamberAPPLIED MATERIALS INC·Filed 1994·Granted Sep 24, 1996·1.2k cites·36 claims
- 0699US5531835APatterned susceptor to reduce electrostatic force in a CVD chamberAPPLIED MATERIALS INC·Filed 1994·Granted Jul 2, 1996·852 cites·6 claims
- 0798US6258170B1Vaporization and deposition apparatusAPPLIED MATERIALS INC·Filed 1997·Granted Jul 10, 2001·307 cites·47 claims
- 0897US6210485B1Chemical vapor deposition vaporizerAPPLIED MATERIALS INC·Filed 1999·Granted Apr 3, 2001·450 cites·56 claims
- 0997US6056823ATemperature controlled gas feedthroughAPPLIED MATERIALS INC·Filed 1998·Granted May 2, 2000·167 cites·23 claims
- 1097US5680013ACeramic protection for heated metal surfaces of plasma processing chamber exposed to chemically aggressive gaseous environment therein and method of protecting such heated metal surfacesAPPLIED MATERIALS INC·Filed 1994·Granted Oct 21, 1997·177 cites·30 claims
- 1196US5968379AHigh temperature ceramic heater assembly with RF capability and related methodsAPPLIED MATERIALS INC·Filed 1997·Granted Oct 19, 1999·262 cites·35 claims
- 1296US5964947ARemovable pumping channel liners within a chemical vapor deposition chamberAPPLIED MATERIALS INC·Filed 1997·Granted Oct 12, 1999·96 cites·20 claims
- 1395US6358810B1Method for superior step coverage and interface control for high K dielectric capacitors and related electrodesAPPLIED MATERIALS INC·Filed 1998·Granted Mar 19, 2002·154 cites·37 claims
- 1494US6527865B1Temperature controlled gas feedthroughAPPLIED MATERIALS INC·Filed 2000·Granted Mar 4, 2003·89 cites·61 claims
- 1593US6066209ACold trapAPPLIED MATERIALS INC·Filed 1998·Granted May 23, 2000·80 cites·23 claims
- 1693US5959409ACeramic protection for heated metal surfaces of plasma processing chamber exposed to chemically aggressive gaseous environment therein and method protecting such heated metal surfacesAPPLIED MATERIALS INC·Filed 1997·Granted Sep 28, 1999·81 cites·33 claims
- 1790US6616767B2High temperature ceramic heater assembly with RF capabilityAPPLIED MATERIALS INC·Filed 1998·Granted Sep 9, 2003·114 cites·19 claims
- 1890US5994678AApparatus for ceramic pedestal and metal shaft assemblyAPPLIED MATERIALS INC·Filed 1997·Granted Nov 30, 1999·89 cites·22 claims
- 1990US5496142ASlotted conical spring washerAPPLIED MATERIALS INC·Filed 1993·Granted Mar 5, 1996·75 cites·23 claims
- 2089US5853607ACVD processing chamberAPPLIED MATERIALS INC·Filed 1995·Granted Dec 29, 1998·91 cites·5 claims
- 2187US7629031B2Plasma enhanced bonding for improving adhesion and corrosion resistance of deposited filmsSUB ONE TECHNOLOGY INC·Filed 2007·Granted Dec 8, 2009·9 cites·38 claims
- 2287US6165271ATemperature controlled process and chamber lidAPPLIED MATERIALS INC·Filed 1998·Granted Dec 26, 2000·49 cites·32 claims
- 2386US5454903APlasma cleaning of a CVD or etch reactor using helium for plasma stabilizationAPPLIED MATERIALS INC·Filed 1993·Granted Oct 3, 1995·59 cites·21 claims
- 2482US6270859B2Plasma treatment of titanium nitride formed by chemical vapor depositionAPPLIED MATERIALS INC·Filed 1998·Granted Aug 7, 2001·42 cites·22 claims
- 2580US6082714AVaporization apparatus and processAPPLIED MATERIALS INC·Filed 1998·Granted Jul 4, 2000·32 cites·39 claims
- 2678US5705225AMethod of filling pores in anodized aluminum partsAPPLIED MATERIALS INC·Filed 1996·Granted Jan 6, 1998·33 cites·2 claims
- 2775US5779807AMethod and apparatus for removing particulates from semiconductor substrates in plasma processing chambersAPPLIED MATERIALS INC·Filed 1996·Granted Jul 14, 1998·41 cites·5 claims
- 2874US6096134ALiquid delivery systemAPPLIED MATERIALS INC·Filed 1998·Granted Aug 1, 2000·23 cites·20 claims
- 2974US6063199ATemperature controlled linerAPPLIED MATERIALS INC·Filed 1998·Granted May 16, 2000·23 cites·20 claims
- 3071US6635114B2High temperature filter for CVD apparatusAPPLIED MATERIAL INC·Filed 1999·Granted Oct 21, 2003·34 cites·28 claims
- 3171US5589003AShielded substrate support for processing chamberAPPLIED MATERIALS INC·Filed 1996·Granted Dec 31, 1996·34 cites·24 claims
- 3270US6077562AMethod for depositing barium strontium titanateAPPLIED MATERIALS INC·Filed 1998·Granted Jun 20, 2000·19 cites·10 claims
- 3361US6214160B1Method and apparatus for removing particulates from semiconductor substrates in plasma processing chambersAPPLIED MATERIALS INC·Filed 1998·Granted Apr 10, 2001·23 cites·14 claims
- 3456US6123773AGas manifoldAPPLIED MATERIALS INC·Filed 1998·Granted Sep 26, 2000·10 cites·3 claims
- 3553US2009065056A1Hybrid photovoltaically active layer and method for forming such a layerSUB ONE TECHNOLOGY·Filed 2008·Application pending·0 cites
- 3637US2003000645A1Apparatus and method for reducing leakage in a capacitor stackFiled 2001·Application pending·0 cites
- 3735US2003019858A1Ceramic heater with thermal pipe for improving temperature uniformity, efficiency and robustness and manufacturing methodAPPLIED MATERIALS INC·Filed 2001·Application pending·0 cites
- 3834US2002197793A1Low thermal budget metal oxide deposition for capacitor structuresFiled 2001·Application pending·0 cites
- 3934US2002015855A1System and method for depositing high dielectric constant materials and compatible conductive materialsFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →