Inventor · disambiguated record
Yuji Kunimoto
Also filed as: KUNIMOTO YUJI
25 granted patents·1 pending application·251 citations·filing 1986–2018
95Inventor score
Files withSHINKO ELECTRIC IND CO15KUNIMOTO YUJI6HOUSE FOOD INDUSTRIAL CO3UCHIYAMA KENTA1YAMANO TAKAHARU1
Top patents by PatentIndex Score
26 records- 0197US8941230B2Semiconductor package and manufacturing methodSHINKO ELECTRIC IND CO·Filed 2013·Granted Jan 27, 2015·79 cites·5 claims
- 0297US7989707B2Chip embedded substrate and method of producing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Aug 2, 2011·71 cites·12 claims
- 0394US8793868B2Chip embedded substrate and method of producing the sameYAMANO TAKAHARU·Filed 2011·Granted Aug 5, 2014·14 cites·6 claims
- 0490US8410614B2Semiconductor device having a semiconductor element buried in an insulating layer and method of manufacturing the sameKUNIMOTO YUJI·Filed 2011·Granted Apr 2, 2013·14 cites·6 claims
- 0589US9412687B2Wiring substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2015·Granted Aug 9, 2016·6 cites·6 claims
- 0682US8907489B2Wiring substrate, method of manufacturing the same, and semiconductor deviceKUNIMOTO YUJI·Filed 2012·Granted Dec 9, 2014·5 cites·3 claims
- 0776US8530753B2Fine wiring package and method of manufacturing the sameKUNIMOTO YUJI·Filed 2009·Granted Sep 10, 2013·8 cites·4 claims
- 0876US8318543B2Method of manufacturing semiconductor deviceKUNIMOTO YUJI·Filed 2009·Granted Nov 27, 2012·5 cites·10 claims
- 0975US9736941B1Wiring substrateSHINKO ELECTRIC IND CO·Filed 2017·Granted Aug 15, 2017·2 cites·9 claims
- 1073US9332658B2Wiring board, semiconductor device, and method for manufacturing wiring boardSHINKO ELECTRIC IND CO·Filed 2014·Granted May 3, 2016·2 cites·5 claims
- 1172US8736073B2Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2013·Granted May 27, 2014·3 cites·11 claims
- 1265US8399977B2Resin-sealed package and method of producing the sameKUNIMOTO YUJI·Filed 2009·Granted Mar 19, 2013·3 cites·8 claims
- 1362US8110921B2Semiconductor package and method of manufacturing the sameKUNIMOTO YUJI·Filed 2009·Granted Feb 7, 2012·2 cites·10 claims
- 1460US7598608B2Mounting substrateSHINKO ELECTRIC IND CO·Filed 2007·Granted Oct 6, 2009·2 cites·5 claims
- 1558US10134680B2Electronic part embedded substrate and method of producing an electronic part embedded substrateSHINKO ELECTRIC IND CO·Filed 2017·Granted Nov 20, 2018·0 cites·16 claims
- 1658US9451702B2Chip embedded substrate and method of producing the sameSHINKO ELECTRIC IND CO·Filed 2014·Granted Sep 20, 2016·0 cites·19 claims
- 1757US9768122B2Electronic part embedded substrate and method of producing an electronic part embedded substrateSHINKO ELECTRIC IND CO·Filed 2016·Granted Sep 19, 2017·0 cites·19 claims
- 1854US9198290B2Wiring substrate, method of manufacturing the same, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2014·Granted Nov 24, 2015·0 cites·8 claims
- 1954US8314347B2Wiring board with lead pins and method of producing the sameUCHIYAMA KENTA·Filed 2009·Granted Nov 20, 2012·0 cites·13 claims
- 2051US10477703B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2018·Granted Nov 12, 2019·0 cites·12 claims
- 2148US9646926B2Wiring substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2016·Granted May 9, 2017·0 cites·16 claims
- 2245US4818545AFood material-container combinationHOUSE FOOD INDUSTRIAL CO·Filed 1986·Granted Apr 4, 1989·16 cites·2 claims
- 2340US9824963B2Wiring board, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2016·Granted Nov 21, 2017·0 cites·5 claims
- 2438US5084288APremix for cooking by a microwave oven and process of preparation thereofHOUSE FOOD INDUSTRIAL CO·Filed 1989·Granted Jan 28, 1992·7 cites·15 claims
- 2538US4705209AErectable containerHOUSE FOOD INDUSTRIAL CO·Filed 1986·Granted Nov 10, 1987·12 cites·2 claims
- 2637US2010219522A1Semiconductor device and method of manufacturing the same, and electronic apparatusSHINKO ELECTRIC IND CO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →