Semiconductor device and method of manufacturing the same, and electronic apparatus

Abstract

A first sealing resin seals a side surface of an electronic component and a side surface of a conductive member. A second sealing resin is provided on the first sealing resin, and seals an electrode pad and an electrode pad forming surface of the electronic component and a part of the conductive member. A multilayer wiring structure includes a plurality of stacked insulating layers and a wiring pattern and is provided on a surface of the second sealing resin from which a connecting surface of the electrode pad and a first connecting surface of the conductive member are exposed. The wiring pattern is connected to the connecting surface of the electrode pad and the first connecting surface of the conductive member.

1 . A semiconductor device comprising:
 an electronic component including an electrode pad, an electrode pad forming surface on which the electrode pad is formed, and a back face positioned on an opposite side to the electrode pad forming surface;   a conductive member which includes a first connecting surface disposed on an electrode pad forming surface side and a second connecting surface disposed on a back face side;   a first sealing resin which includes a first surface disposed on the electrode pad forming surface side and a second surface disposed on the back face side, and seals a side surface of the electronic component and a side surface of the conductive member;   a second sealing resin which is provided on the first surface of the first sealing resin, and seals the electrode pad, the electrode pad forming surface and a part of the conductive member in a state that a connecting surface of the electrode pad and the first connecting surface of the conductive member are exposed from the second sealing resin; and   a multilayer wiring structure which is provided on a surface of the second sealing resin from which the connecting surface of the electrode pad and the first connecting surface of the conductive member are exposed, and includes a plurality of stacked insulating layers and a wiring pattern,   wherein the wiring pattern is connected to the connecting surface of the electrode pad and the first connecting surface of the conductive member.   
     
     
         2 . The semiconductor device according to  claim 1 , wherein the conductive member is a conductive ball or a metal post. 
     
     
         3 . The semiconductor device according to  claim 1 , wherein a thickness of the first sealing resin is greater than a thickness of the second sealing resin and a thickness of the multilayer wiring structure. 
     
     
         4 . The semiconductor device according to  claim 1 , wherein the wiring pattern includes a via directly connected to the connecting surface of the electrode pad. 
     
     
         5 . The semiconductor device according to  claim 1 , wherein the connecting surface of the electrode pad and the first connecting surface of the conductive member are disposed on the same plane. 
     
     
         6 . A method of manufacturing a semiconductor device including a multilayer wiring structure having a plurality of stacked insulating layers and a wiring pattern, and an electronic component having an electrode pad to be electrically connected to the wiring pattern, the method comprising:
 a first step of forming a first sealing resin set in a semicuring state on a surface of a first support;   a second step of pushing a plurality of conductive members against the surface of the first support to penetrate through the first sealing resin, thereby providing the conductive members in the first sealing resin in a state in which a first connecting surface of each of the conductive members is protruded from the first sealing resin;   a third step of bonding the electronic component to a second support in such a manner that a flat surface of the second support comes in contact with a connecting surface of the electrode pad of the electronic component;   a fourth step of disposing the electronic component bonded to the second support and the first sealing resin opposite to each other and then pressing the first support and the second support to each other until the first connecting surface and the flat surface of the second support come in contact with each other, and thereafter curing the first sealing resin completely, thereby sealing a side surface of the electronic component;   a fifth step of removing the second support after the fourth step;   a sixth step of forming a second sealing resin on a surface of the first sealing resin positioned on an opposite side to a surface coming in contact with the first support in a state that the connecting surface of the electrode pad of the electronic component and the first connecting surface of the conductive member are exposed from the second sealing resin;   a seventh step of forming the multilayer wiring structure on the surface of the second sealing resin from which the connecting surface of the electrode pad of the electronic component and the first connecting surface of the conductive member are exposed in a state that the wiring pattern is connected to the connecting surface of the electrode pad of the electronic component and the first connecting surface of the conductive member; and   an eighth step of removing the first support after the seventh step.   
     
     
         7 . The method of manufacturing a semiconductor device according to  claim 6 , further comprising:
 a ninth step of polishing the conductive member, the first sealing resin and the electronic component from a side on which the first support is provided after the eighth step so that the electronic component is changed into a thinned plate and, a second connecting surface formed on the conductive member through the polishing, a back face of the electronic component which is subjected to the polishing and a surface of the first sealing resin on a polishing side are disposed on the same plane.   
     
     
         8 . The method of manufacturing a semiconductor device according to  claim 6 , wherein the conductive member is a conductive ball or a metal post. 
     
     
         9 . An electronic apparatus comprising:
 the semiconductor device according to  claim 1 ; and   another semiconductor device which is disposed on a second surface side of the first sealing resin of the semiconductor device, and includes a connecting terminal being electrically connected to the second connecting surface of the conductive member of the semiconductor device.