Assignee
YAMANO TAKAHARU
JP·9 granted patents·3 pending applications·43 citations·filing 2005–2012
Top patents by PatentIndex Score
12 records- 0194US8793868B2Chip embedded substrate and method of producing the sameYAMANO TAKAHARU·Filed 2011·Granted Aug 5, 2014·14 cites·6 claims
- 0285US8253229B2Semiconductor package and stacked layer type semiconductor packageYAMANO TAKAHARU·Filed 2007·Granted Aug 28, 2012·14 cites·10 claims
- 0379US8415796B2Semiconductor device having a multilayer structureYAMANO TAKAHARU·Filed 2011·Granted Apr 9, 2013·5 cites·7 claims
- 0470US8564116B2Semiconductor device with reinforcement plate and method of forming sameYAMANO TAKAHARU·Filed 2010·Granted Oct 22, 2013·3 cites·3 claims
- 0568US8211754B2Semiconductor device and manufacturing method thereofYAMANO TAKAHARU·Filed 2009·Granted Jul 3, 2012·3 cites·14 claims
- 0662US8193617B2Semiconductor device and manufacturing method thereforYAMANO TAKAHARU·Filed 2009·Granted Jun 5, 2012·2 cites·13 claims
- 0761US9564364B2Semiconductor device, semiconductor package, method for manufacturing semiconductor device, and method for manufacturing semiconductor packageYAMANO TAKAHARU·Filed 2012·Granted Feb 7, 2017·1 cites·20 claims
- 0861US8299586B2Semiconductor device and method of manufacturing the sameYAMANO TAKAHARU·Filed 2010·Granted Oct 30, 2012·1 cites·14 claims
- 0950US2006096781A1Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the sameYAMANO TAKAHARU·Filed 2005·Application pending·0 cites
- 1049US2006001173A1Through electrode and method for forming the sameYAMANO TAKAHARU·Filed 2005·Application pending·0 cites
- 1148US8102048B2Electronic device manufacturing method and electronic deviceYAMANO TAKAHARU·Filed 2008·Granted Jan 24, 2012·0 cites·3 claims
- 1246US2005263907A1Method of manufacturing semiconductor device and support structure for semiconductor substrateYAMANO TAKAHARU·Filed 2005·Application pending·0 cites
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