Inventor · disambiguated record
Masanori Ohashi
Also filed as: OHASHI MASANORI
22 granted patents·3 pending applications·339 citations·filing 1991–2017
96Inventor score
Files withSONY CORP15SONY SEMICONDUCTOR SOLUTIONS CORP2TATANI KEIJI2TOSHIBA IND PRODUCTS MFG CORP2KANZAKI PAPER MFG CO LTD1
Top patents by PatentIndex Score
25 records- 0187US7170209B2Rotor for reluctance type rotating machineTOSHIBA IND PRODUCTS MFG CORP·Filed 2004·Granted Jan 30, 2007·48 cites·8 claims
- 0286US7943962B2Solid-state image pickup device and method for producing the sameSONY CORP·Filed 2009·Granted May 17, 2011·5 cites·3 claims
- 0385US5734195ASemiconductor wafer for epitaxially grown devices having a sub-surface getter regionSONY CORP·Filed 1996·Granted Mar 31, 1998·63 cites·17 claims
- 0484US8652864B2Solid-state image pickup device and method for producing the sameTATANI KEIJI·Filed 2010·Granted Feb 18, 2014·2 cites·8 claims
- 0582US7057322B2Rotor for reluctance type rotating machineTOSHIBA KK·Filed 2004·Granted Jun 6, 2006·32 cites·2 claims
- 0681US7465598B2Solid-state imaging device and method for fabricating sameSONY CORP·Filed 2007·Granted Dec 16, 2008·4 cites·16 claims
- 0781US7420234B2Solid-state imaging device and method for fabricating sameSONY CORP·Filed 2005·Granted Sep 2, 2008·4 cites·6 claims
- 0877US7351598B2Solid-stage image pickup device and method for producing the sameSONY CORP·Filed 2006·Granted Apr 1, 2008·2 cites·4 claims
- 0973US7898000B2Solid-state image pickup device and method for producing the sameSONY CORP·Filed 2008·Granted Mar 1, 2011·1 cites·12 claims
- 1073US5874348ASemiconductor wafer and method of manufacturing sameSONY CORP·Filed 1996·Granted Feb 23, 1999·34 cites·11 claims
- 1172US7217961B2Solid-state image pickup device and method for producing the sameSONY CORP·Filed 2006·Granted May 15, 2007·1 cites·3 claims
- 1270US6551910B2Method of manufacturing solid-state image pickup deviceSONY CORP·Filed 2001·Granted Apr 22, 2003·14 cites·5 claims
- 1370US5581099ACCD solid state image device which has a semiconductor substrate with a P-type region with an N-type region formed therein by injection of arsenicSONY CORP·Filed 1995·Granted Dec 3, 1996·26 cites·1 claims
- 1466US2017373104A1Solid-state imaging device and method for fabricating sameSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Application pending·0 cites
- 1564US8741681B2Solid-state image pickup device and method for producing the sameTATANI KEIJI·Filed 2010·Granted Jun 3, 2014·0 cites·12 claims
- 1663US5476808AMethod of making CCD solid state image sensing deviceSONY CORP·Filed 1993·Granted Dec 19, 1995·19 cites·4 claims
- 1762US2009085142A1Solid-state imaging device and method for fabricating sameSONY CORP·Filed 2008·Application pending·0 cites
- 1861US5401699AHeat-sensitive recording materialKANZAKI PAPER MFG CO LTD·Filed 1993·Granted Mar 28, 1995·11 cites·3 claims
- 1960US9620545B2Solid-state image pickup device and method for producing the sameSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2014·Granted Apr 11, 2017·0 cites·20 claims
- 2060US6140213ASemiconductor wafer and method of manufacturing sameSONY CORP·Filed 1998·Granted Oct 31, 2000·19 cites·28 claims
- 2159US5288656AMethod of manufacturing a CCD solid state image sensing deviceSONY CORP·Filed 1992·Granted Feb 22, 1994·21 cites·2 claims
- 2257US6252216B1Solid state image pick-up deviceSONY CORP·Filed 1998·Granted Jun 26, 2001·21 cites·32 claims
- 2353US2008299334A1Thermal transfer receiving sheetOJI PAPER CO·Filed 2008·Application pending·0 cites
- 2441US9660507B2Method of manufacturing stator core and the stator coreTOSHIBA IND PRODUCTS MFG CORP·Filed 2013·Granted May 23, 2017·0 cites·4 claims
- 2538US5282208AData transfer system and methodYAMAHA CORP·Filed 1991·Granted Jan 25, 1994·12 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →