Inventor · disambiguated record
Tyler N. Osborn
Also filed as: OSBORN TYLER · OSBORN TYLER N
7 granted patents·6 pending applications·25 citations·filing 2006–2023
80Inventor score
Technology areasH10W
Top patents by PatentIndex Score
13 records- 0182US8970051B2Solution to deal with die warpage during 3D die-to-die stackingSHI HUALIANG·Filed 2013·Granted Mar 3, 2015·12 cites·18 claims
- 0280US8952532B2Integrated circuit package with spatially varied solder resist opening dimensionZHENG TIEYU·Filed 2013·Granted Feb 10, 2015·7 cites·18 claims
- 0370US9397071B2High density interconnection of microelectronic devicesINTEL CORP·Filed 2013·Granted Jul 19, 2016·2 cites·12 claims
- 0469US9177831B2Die assembly on thin dielectric sheetCHIU CHIA-PIN·Filed 2013·Granted Nov 3, 2015·2 cites·15 claims
- 0567US9312237B2Integrated circuit package with spatially varied solder resist opening dimensionINTEL CORP·Filed 2014·Granted Apr 12, 2016·2 cites·6 claims
- 0657US2025218958A1Pedestals for semiconductor components embedded in package substrates and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 0749US9842832B2High density interconnection of microelectronic devicesINTEL CORP·Filed 2016·Granted Dec 12, 2017·0 cites·20 claims
- 0846US2016043056A1Die assembly on thin dielectric sheetINTEL CORP·Filed 2015·Application pending·0 cites
- 0943US2017012029A1Tsv-connected backside decouplingINTEL CORP·Filed 2014·Application pending·0 cites
- 1039US2016260679A1Hybrid interconnect for low temperature attachINTEL CORP·Filed 2014·Application pending·0 cites
- 1136US2008073795A1Integrated circuit interconnection devices and methodsGEORGIA TECH RES INST·Filed 2006·Application pending·0 cites
- 1235US9786517B2Ablation method and recipe for wafer level underfill material patterning and removalDIAS RAJENDRA C·Filed 2013·Granted Oct 10, 2017·0 cites·13 claims
- 1331US2015072515A1Laser ablation method and recipe for sacrificial material patterning and removalDIAS RAJENDRA C·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →