Inventor · disambiguated record
Hyeog Chan Kwon
Also filed as: KWON HYEOG C · KWON HYEOG CHAN
20 granted patents·7 pending applications·272 citations·filing 2004–2011
95Inventor score
Top patents by PatentIndex Score
27 records- 0198US7288835B2Integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2006·Granted Oct 30, 2007·135 cites·17 claims
- 0293US7737539B2Integrated circuit package system including honeycomb moldingSTATS CHIPPAC LTD·Filed 2006·Granted Jun 15, 2010·30 cites·19 claims
- 0391US8375576B2Method for manufacturing wafer scale heat slug systemSTATS CHIPPAC LTD·Filed 2011·Granted Feb 19, 2013·12 cites·7 claims
- 0489US7501697B2Integrated circuit package systemSTATS CHIPPAC LTD·Filed 2006·Granted Mar 10, 2009·16 cites·9 claims
- 0587US7456088B2Integrated circuit package system including stacked dieSTATS CHIPPAC LTD·Filed 2006·Granted Nov 25, 2008·13 cites·10 claims
- 0686US7652376B2Integrated circuit package system including stacked dieSTATS CHIPPAC LTD·Filed 2008·Granted Jan 26, 2010·11 cites·9 claims
- 0785US8030134B2Stacked semiconductor package having adhesive/spacer structure and insulationCHIPPAC INC·Filed 2006·Granted Oct 4, 2011·10 cites·32 claims
- 0880US7975377B2Wafer scale heat slug systemSTATS CHIPPAC LTD·Filed 2006·Granted Jul 12, 2011·9 cites·13 claims
- 0978US7545031B2Multipackage module having stacked packages with asymmetrically arranged die and moldingSTATS CHIPPAC LTD·Filed 2006·Granted Jun 9, 2009·7 cites·15 claims
- 1076US7755180B2Integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2007·Granted Jul 13, 2010·5 cites·17 claims
- 1175US7884460B2Integrated circuit packaging system with carrier and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Feb 8, 2011·5 cites·8 claims
- 1274US8623704B2Adhesive/spacer island structure for multiple die packageLEE SANG HO·Filed 2006·Granted Jan 7, 2014·5 cites·14 claims
- 1371US8067831B2Integrated circuit package system with planar interconnectsKWON HYEOG CHAN·Filed 2005·Granted Nov 29, 2011·6 cites·20 claims
- 1468US7875966B2Stacked integrated circuit and package systemSTATS CHIPPAC LTD·Filed 2005·Granted Jan 25, 2011·3 cites·5 claims
- 1565US8552551B2Adhesive/spacer island structure for stacking over wire bonded dieLEE SANG HO·Filed 2005·Granted Oct 8, 2013·3 cites·13 claims
- 1659US8217501B2Integrated circuit package system including honeycomb moldingKWON HYEOG CHAN·Filed 2010·Granted Jul 10, 2012·1 cites·20 claims
- 1754US7932593B2Multipackage module having stacked packages with asymmetrically arranged die and moldingSTATS CHIPPAC LTD·Filed 2009·Granted Apr 26, 2011·0 cites·22 claims
- 1850US8049322B2Integrated circuit package-in-package system and method for making thereofSTATS CHIPPAC LTD·Filed 2010·Granted Nov 1, 2011·0 cites·14 claims
- 1950US2007013060A1Stacked Semiconductor Package having Adhesive/Spacer Structure and InsulationCHIPPAC INC·Filed 2006·Application pending·0 cites
- 2047US2005269692A1Stacked semiconductor package having adhesive/spacer structure and insulationCHIPPAC INC·Filed 2005·Application pending·0 cites
- 2144US8102043B2Stacked integrated circuit and package system and method for manufacturing thereofJEONG TAE SUNG·Filed 2011·Granted Jan 24, 2012·0 cites·13 claims
- 2244US7306971B2Semiconductor chip packaging method with individually placed film adhesive piecesCHIPPAC INC·Filed 2004·Granted Dec 11, 2007·1 cites·4 claims
- 2341US2005258527A1Adhesive/spacer island structure for multiple die packageCHIPPAC INC·Filed 2004·Application pending·0 cites
- 2440US2007085184A1Stacked die packaging systemSTATS CHIPPAC LTD·Filed 2005·Application pending·0 cites
- 2539US2005258545A1Multiple die package with adhesive/spacer structure and insulated die surfaceCHIPPAC INC·Filed 2004·Application pending·0 cites
- 2638US2005208700A1Die to substrate attach using printed adhesiveCHIPPAC INC·Filed 2004·Application pending·0 cites
- 2737US2005224959A1Die with discrete spacers and die spacing methodCHIPPAC INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →