Inventor · disambiguated record
Sung-Dong Cho
Also filed as: CHO SUNG-DONG
14 granted patents·5 pending applications·70 citations·filing 2002–2022
90Inventor score
Files withSAMSUNG ELECTRONICS CO LTD12CHO SUNG-DONG1KIM EUN-JI1KOREA ADVANCED INST SCI & TECH1LEE HO JIN1
Top patents by PatentIndex Score
19 records- 0193US8592988B2Semiconductor deviceLEE HO-JIN·Filed 2011·Granted Nov 26, 2013·19 cites·11 claims
- 0291US11289402B2Semiconductor device including TSV and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 29, 2022·8 cites·21 claims
- 0383US9559002B2Methods of fabricating semiconductor devices with blocking layer patternsSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 31, 2017·4 cites·17 claims
- 0483US8841754B2Semiconductor devices with stress relief layersSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 23, 2014·8 cites·16 claims
- 0581US9293415B2Semiconductor devices including protection patterns and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 22, 2016·4 cites·20 claims
- 0681US8890282B2Integrated circuit devices including through-silicon via (TSV) contact pads electronically insulated from a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 18, 2014·6 cites·20 claims
- 0776US7879720B2Methods of forming electrical interconnects using electroless plating techniques that inhibit void formationSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 1, 2011·7 cites·18 claims
- 0871US8836109B2Semiconductor device and method of manufacturing a semiconductor deviceYUN KI-YOUNG·Filed 2012·Granted Sep 16, 2014·9 cites·15 claims
- 0965US11705386B2Semiconductor device including TSV and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 18, 2023·0 cites·20 claims
- 1061US9418915B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 16, 2016·1 cites·13 claims
- 1155US8729684B2Interposer chip, multi-chip package including the interposer chip, and method of manufacturing the samePARK YEONG-LYEOL·Filed 2011·Granted May 20, 2014·1 cites·10 claims
- 1253US11887840B2Semiconductor device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 30, 2024·0 cites·20 claims
- 1350US2014225113A1Interposer chip, multi-chip package including the interposer chip, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 1449US7381468B2Polymer/ceramic composite paste for embedded capacitor and method for fabricating capacitor using sameKOREA ADVANCED INST SCI & TECH·Filed 2004·Granted Jun 3, 2008·3 cites·13 claims
- 1547US2022415621A1Focus ring for improvement of semiconductor plasma etching processONE SEMICON CO LTD·Filed 2022·Application pending·0 cites
- 1646US2010099250A1Methods of Forming Integrated Circuit Contact Pads Using Electroless Plating of Diffusion Barrier LayersSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1740US2015137388A1Semiconductor devicesKIM EUN-JI·Filed 2014·Application pending·0 cites
- 1839US6719917B2Method of ashing semiconductor device having metal interconnectionSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Apr 13, 2004·0 cites·18 claims
- 1938US2013052760A1Method of inspecting and manufacturing a stack chip packageCHO SUNG-DONG·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →